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Cameron P Jue

from Seattle, WA
Age ~38
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Also known as:
Cameron J Jue, Peter Jue Cameron
Phone and address:
4716 Interlake Ave N, Seattle, WA 98103
Related to:
Jun W Jue
Connected to:
Ai L Jue, 73Annette T Jue, 61Joann R Jue, 83Kaelynne L Jue, 29Leong M Jue, 63Lorraine V Jue, 106Sheryl L Jue, 30Teruko T Jue, 97Wayne A Jueal, 71Willian A Juearez, 45

Cameron Jue Phones & Addresses

  • 4716 Interlake Ave N, Seattle, WA 98103
  • Redmond, WA
  • Santa Cruz, CA
  • Stanford, CA
  • Worcester, MA

Work

Company: Makerhaus Apr 2013 Position: Working member

Education

Degree: Master of Science (MS) School / High School: Stanford University 2010 to 2012 Specialities: Product Design

Skills

Product Development • Engineering • Rapid Prototyping • Medical Devices • Industrial Design • Mechanical Engineering • Solidworks • Design Thinking • Product Design • Pro Engineer • Ethnography • Design For Manufacturing • Machining • Design Research • Interaction Design

Industries

Design

Resumes

Resumes

Cameron Jue Photo 1

Product Design Engineer

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Location:
1501 Pike Pl, Seattle, WA 98101
Industry:
Design
Work:
MakerHaus since Apr 2013
Working Member
Stanford University PRL Apr 2011 - Jun 2012
Teaching Assistant
Synapse Product Development Jun 2011 - Sep 2011
Mechanical Engineering Intern
Grove Instruments Nov 2009 - Jun 2010
Engineering Intern
IDEO May 2008 - Aug 2008
Summer Intern
Education:
Stanford University 2010 - 2012
Master of Science (MS), Product Design Rhode Island School of Design 2006 - 2009
Supplemental Courses, Industrial Design Brown University 2005 - 2009
Bachelor of Science (BS), Mechanical Engineering
Skills:
Product Development
Engineering
Rapid Prototyping
Medical Devices
Industrial Design
Mechanical Engineering
Solidworks
Design Thinking
Product Design
Pro Engineer
Ethnography
Design For Manufacturing
Machining
Design Research
Interaction Design

Publications

Us Patents

Thermal Management System For Electronic Device

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US Patent:
20230035571, Feb 2, 2023
Filed:
Jul 30, 2021
Appl. No.:
17/390351
Inventors:
- Menlo Park CA, US
Cameron Peter Jue - Seattle WA, US
Balaji Chelladurai - Bellevue WA, US
International Classification:
G02B 27/01
G06F 1/20
H05K 7/20
Abstract:
A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.

Thermal Management System For Electronic Device

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US Patent:
20230030748, Feb 2, 2023
Filed:
Jul 30, 2021
Appl. No.:
17/390288
Inventors:
- Menlo Park CA, US
Cameron Peter Jue - Seattle WA, US
Rajat Mittal - Fremont CA, US
Ryan Fleming - Oakland CA, US
Boyd Drew Allin - Seattle WA, US
International Classification:
G02B 27/01
G06F 1/20
H05K 7/20
Abstract:
A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
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Cameron P Jue from Seattle, WA, age ~38 Get Report