John Isenberg Phones & Addresses
-
5234 Mann Rd, Indianapolis, IN 46221 (317) 856-7754 (317) 856-7792 (317) 856-8091
-
New Palestine, IN
-
Philadelphia, PA
-
5234 Mann Rd, Indianapolis, IN 46221 (317) 856-7792
Work
Position:
Farmer
Emails
j***g@bellsouth.net
Business Records
Name / Title
Company / Classification
Phones & Addresses
Principal
Isenberg Enterprises
Business Services at Non-Commercial Site
Business Services at Non-Commercial Site
5234 Mann Rd, Indianapolis, IN 46221
Publications
Us Patents
Method Of Attaching A Flip Chip Device And Circuit Assembly Formed Thereby
View pageUS Patent:
7038321, May 2, 2006
Filed:
Apr 29, 2005
Appl. No.:
10/908162
Inventors:
Abhijeet V. Chavan - Carmel IN, US
Jeffrey A. Mars - Kokomo IN, US
Ian D. Jay - Logansport IN, US
Johnna L. Wyant - Kokomo IN, US
David W. Ihms - Russiaville IN, US
John K. Isenberg - Rossville IN, US
Roger E. Worl - Russiaville IN, US
Jeffrey A. Mars - Kokomo IN, US
Ian D. Jay - Logansport IN, US
Johnna L. Wyant - Kokomo IN, US
David W. Ihms - Russiaville IN, US
John K. Isenberg - Rossville IN, US
Roger E. Worl - Russiaville IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01L 23/52
H01L 23/48
H01L 29/40
H01L 23/48
H01L 29/40
US Classification:
257778, 257678, 257414, 257415, 257728, 257782, 257786, 438124, 438126, 438127, 310313 R, 310340, 361772
Abstract:
A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a circuit assembly produced thereby. The assembly includes a substrate having at least two sets of bonding sites spaced apart from each other to define an intermediate surface region therebetween. The device is attached to the bonding sites with solder connections, with the solder connections being present on a surface of the device that faces the substrate and on which the element is present so that the element overlies the intermediate surface region of the substrate. An underfill material is present between the device and the substrate and encapsulates the solder connections. The underfill material is separated from the intermediate surface region of the substrate so that the underfill material does not contact the element.
Multiple Hydraulic Circuit Pressure Sensor
View pageUS Patent:
20130036826, Feb 14, 2013
Filed:
Jun 3, 2011
Appl. No.:
13/695170
Inventors:
Daniel R. Dahlgren - Cicero IN, US
Daniel A. Lawlyes - Kokomo IN, US
Markus Naegeli - Kokomo IN, US
John K. Isenberg - Rossville IN, US
Lewis Henry Little - Peru IN, US
Daniel A. Lawlyes - Kokomo IN, US
Markus Naegeli - Kokomo IN, US
John K. Isenberg - Rossville IN, US
Lewis Henry Little - Peru IN, US
Assignee:
DELPHI TECHNOLOGIES, INC. - TROY MI
International Classification:
G01L 9/04
G01L 9/02
G01L 9/02
US Classification:
73720, 73719
Abstract:
A hydraulic solenoid assembly for complex vehicle-borne control systems, such as automatic transmissions, includes a solenoid body or unitary housing operatively enclosing two or more solenoid valves. Each valve has a pressure port extending to an outer surface of the housing, emerging in a spaced-apart matrix. A metal (stainless steel or aluminum) sensor plate is mounted to the outer surface of the housing so as to sealingly overlay the pressure ports. A diaphragm is formed in the sensor plate for each solenoid valve and registers with its associated pressure port. Electrical components, such as thick file resistors arranged in a Wheatstone bridge network are printed or mounted to an outer surface of each diaphragm. The bridge networks are electrically connected to a control circuit and function to output signals as a function of hydraulic pressure induced displacement of the associated diaphragm.
Thick-Film Paste With Insoluble Additive
View pageUS Patent:
63289148, Dec 11, 2001
Filed:
Jan 29, 1999
Appl. No.:
9/240084
Inventors:
Frans Peter Lautzenhiser - Noblesville IN
Carl William Berlin - West Lafayette IN
Bradley Howard Carter - Kokomo IN
John Karl Isenberg - Rossville IN
Carl William Berlin - West Lafayette IN
Bradley Howard Carter - Kokomo IN
John Karl Isenberg - Rossville IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01B 106
H01C 106
H01C 106
US Classification:
252510
Abstract:
A thick-film paste for printing thick-film circuit elements, including solder stops, conductors, resistors and capacitors, and a method for using the paste. The paste has a composition that includes an organic vehicle, a filler material that contributes the desired electrical and/or material properties to the thick film fired from the paste, and an additive that is insoluble in the organic vehicle and contributes pseudoplastic Theological properties to the paste during printing. The additive also preferably evaporates, burns off, sublimates or is otherwise removed below the firing temperature of the paste.
Method Of Manufacturing A Thick Film Circuit With Constrained Adhesive Spreading
View pageUS Patent:
61645222, Dec 26, 2000
Filed:
Aug 27, 1999
Appl. No.:
9/384892
Inventors:
Frans Peter Lautzenhiser - Noblesville IN
John Karl Isenberg - Rossville IN
John Karl Isenberg - Rossville IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
B05D 512
B23K 3102
B23K 3102
US Classification:
228175
Abstract:
An improved method of manufacturing thick film circuit wherein an IC is attached to a central conductor pad with adhesive, and wherein spreading of the adhesive is constrained by a ring of porous dielectric material formed between the central conductor pad and the peripheral conductor pads to which the IC terminals are bonded. When the adhesive material is printed and begins to spread, it contacts the porous dielectric ring, which absorbs the adhesive material and stops the spreading. In this way, the porous dielectric ring controls the dimensions of the cured adhesive, thereby preventing the adhesive from contaminating the peripheral conductor pads. Even with the addition of the intervening dielectric ring, the length of the wire-bond connections and the overall dimension of the IC and its conductor pads are both significantly decreased, contributing to improved circuit area utilization and wire-bond durability.
Method Of Manufacture For A Thick Film Multi-Layer Circuit
View pageUS Patent:
59103345, Jun 8, 1999
Filed:
Dec 16, 1997
Appl. No.:
8/991685
Inventors:
Frans Peter Lautzenhiser - Noblesville IN
John Karl Isenberg - Rossville IN
James Edward Walsh - W. Lafayette IN
Adam Wade Schubring - Kokomo IN
John Karl Isenberg - Rossville IN
James Edward Walsh - W. Lafayette IN
Adam Wade Schubring - Kokomo IN
Assignee:
Delco Electronics Corporation - Kokomo IN
International Classification:
B05D 512
US Classification:
427 96
Abstract:
An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired. This results in a thicker dielectric layer for the same number of successive printing steps, and at the same time, smaller dielectric features.