Patrick M Johnson

6496372, Dec 17, 2002

Sep 26, 2001

09/964233

Peter A. Davison - Puyallup WA
Lee M. Langseth - Hillsboro OR
Patrick S. Johnson - Tacoma WA

Intel Corporation - Santa Clara CA

H05K 720

361704, 361707, 361709, 174 163, 165 803, 257718, 257719, 257727, 24453, 24297, 411508, 411509, 411510

The present invention relates to an electronic assembly that includes an integrated circuit package, a heat sink, and a fastener which connects the heat sink to the integrated circuit package to cool the integrated circuit package. The fastener includes a stem that extends through the heat sink and the integrated circuit package. The fastener further includes a clamp that is connected to one end of the stem and a spring head that is connected to an opposing end of the stem. The spring head includes a first biasing member that extends around the longitudinal axis of the stem to compress the heat sink and the integrated circuit package against the clamp in order to reduce the thermal impedance between the heat sink and the integrated circuit package.

6547448, Apr 15, 2003

May 15, 2001

09/858119

Patrick S. Johnson - Tacoma WA
Dennis G. Koshinz - Bellevue WA

The Boeing Company - Seattle WA

G02B 638

385 70, 385 55

An embeddable fiber optic connector includes a small diameter protective sheath embedded within a plurality of composite layers of a composite structure. The sheath has a first end that is flush with a surface of the composite structure. An alignment sleeve is disposed within the sheath and an internal ferrule, mounted on an internal optical fiber, is snugly disposed within the alignment sleeve proximate a second end of the sheath. An external ferrule is mounted on an external optical fiber and is inserted into the first end of the sheath so as to be snugly disposed within the alignment sleeve proximate the internal ferrule, thereby establishing optical communications between the internal and external optical fibers. The external optical fiber is easily disconnected by gripping and removing the external ferrule from the connector. Reconnection is accomplished by reinserting the external ferrule into the connector.

6934155, Aug 23, 2005

Jun 11, 2003

10/460619

Russell S. Aoki - Tacoma WA, US
Daniel P. Carter - Bainbridge Island WA, US
Patrick S. Johnson - Olympia WA, US
Curtis J. Koepsell - Kent WA, US

Intel Corporation - Santa Clara CA

H05K007/20

361704, 411508, 411349, 411511, 411518, 411521, 257718, 24453, 165 803

A fastener assembly including a base consisting of a pair of motherboard snaps on a first end and a hollow shaft on a second end, the motherboard snaps to be inserted through an aperture of a motherboard. The hollow shaft is inserted through an aperture of a heat sink clip. The base further includes a pair of grooves on an exterior of the shaft. The assembly further including a cap consisting of a hollow interior, an integrated post attached to a base of the interior, and a pair of cantilever snaps. The cap is fitted over the exterior surface of the hollow shaft of the base to secure the clip between the base and the cap. The integrated post of the cap to be inserted into the hollow shaft of the base to deflect the motherboard snaps outward on an opposite side of the motherboard aperture to secure the assembly with the motherboard. The cantilever snaps to be positioned in the grooves of the shaft of the base to secure the cap with the base.

20160363971, Dec 15, 2016

Jun 9, 2015

14/734833

- Redmond WA, US
Patrick Stephen Johnson - Olympia WA, US
Guy Robert Wagner - Loveland CO, US

G06F 1/20

A thermal control system that includes a combination of active and passive components is described herein. In one or more implementation, the thermal control system compensates for non-uniformities in a temperature profile for an arrangement of components within a computing device. One or more active components of the thermal control system transfer heat away from heat-generating devices by active means, such as active transfer to a moving fluid that is driven by a blower or fan. Additionally, one or more passive components are positioned to transfer heat to selected areas of the device using passive transfer devices, such as heat-pipes and thermal spreaders made of conductive materials. The active and passive components operate together to compensate for temperature variations across the device surfaces, produce a controlled temperature profile having greater uniformity, reduce overall differences in surface temperatures, and provide greater capability for heat dissipation.

20140177152, Jun 26, 2014

Dec 21, 2012

13/725705

Patrick S. Johnson - Olympia WA, US
Tod A. Byquist - Federal Way WA, US
Ben M. Broili - Tacoma WA, US

G06F 1/16

36167908, 220 402, 2952502, 295921

A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.