Richard K Mcmillan

6405920, Jun 18, 2002

Jul 12, 2000

09/614830

Bjoern Erik Brunner - Dearborn MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Richard Keith McMillan - Dearborn MI

Visteon Global Technologies, Inc. - Dearborn MI

B23K 3102

2282481, 2281802, 228254

There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate having at least one mounting pad thereon, wherein each mounting pad is arranged in matched relation with a respective termination of an electronic component. Each mounting pad includes a main body portion and one or more fingerlike extensions extending outward from the main body portion and away from a projected footprint of the electronic component.

6467161, Oct 22, 2002

Mar 20, 2001

09/812989

Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Richard Keith McMillan - Dearborn MI
Vivek A. Jairazbhoy - Farmington Hills MI

Visteon Global Tech., Inc. - Dearborn MI

H05K 320

29831, 29846, 29852, 29830

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically connected to a source of ground potential.

6499214, Dec 31, 2002

Mar 20, 2001

09/812449

Delin Li - San Jose CA
Richard Keith McMillan - Dearborn MI
Zhong-You Shi - Ann Arbor MI

Visteon Global Tech, Inc. - Dearborn MI

H05K 320

29831, 29830, 29846, 29852

A method for making multi-layer circuit boards having metallized apertures which may be selectively and electrically grounded and having at least one formed air-bridge.

6501031, Dec 31, 2002

Sep 6, 2000

09/655809

Andrew Z. Glovatsky - Livonia MI
Jay D. Baker - Dearborn MI
Robert Edward Belke - West Bloomfield MI
Myron Lemecha - Dearborn Heights MI
Richard Keith McMillan - Dearborn MI
Thomas B. Krautheim - Belleville MI

Visteon Global Tech., Inc. - Dearborn MI

H05K 111

174262, 29846, 29832, 29852, 29856

A multi-layer electronic circuit board design having a core member a pair of dielectric layers disposed thereon, and a first circuit portion which is coupled to the dielectric layer and core member using a layer of adhesive material Circuit board design further having selectively formed âblindâ apertures, vias or cavities formed through the first circuit portion dielectric layer and adhesive layer thereby exposing core member.

6613239, Sep 2, 2003

Apr 17, 2001

09/836644

Andrew Z. Glovatsky - Plymouth MI
Robert E. Belke - West Bloomfield MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Marc A. Straub - Dearborn Heights MI
Richard K. McMillan - Dearborn MI
Ram S. Raghava - Ann Arbor MI
Thomas B. Krautheim - Belleville MI
Michael A. Howey - Canton MI
Vivek A. Jairazbhoy - Farmington Hills MI

Visteon Global Tech., Inc. - Dearborn MI

B44C 122

216 13, 216 17, 216 41, 174250, 29846

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

6673723, Jan 6, 2004

Mar 22, 2001

09/815226

Bharat Z. Patel - Canton MI, 48187
Jay D. Baker - Dearborn MI, 48121
Lakhi N. Goenka - Ann Arbor MI, 48103
Michael Allen Howey - Canton MI, 48187
Mohan R. Paruchuri - Canton MI, 48187
Richard Keith McMillan - Dearborn MI, 48124

H01L 21302

438745, 438750, 438753, 216 13

A method for making a multi-layer circuit board having at least one electrically conductive interconnection portion or âviaâ which extends within the board and at least one air-bridge The method includes the steps of forming protuberances upon a core member attaching pre-circuit assemblies to the core member thereby forming the circuit board while concomitantly and selectively extending at least one of the protuberances within the formed circuit board.

6717067, Apr 6, 2004

Jul 18, 2002

10/198341

Zhong-You Shi - Ann Arbor MI
Delin Li - San Jose CA
Richard McMillan - Dearborn MI

Visteon Global Tech., Inc. - Dearborn MI

H01R 1204

174261, 174255, 174262, 361792

A method for making multi-layer circuit boards having metallized apertures which may be selectively and electrically grounded and having at least one formed air-bridge.

6772733, Aug 10, 2004

Oct 15, 2002

10/271205

Zhong-You Shi - Ann Arbor MI
Bernard A. Meyer - Taylor MI
Harvinder Singh - Shelby Township MI
Jay DeAvis Baker - West Bloomfield MI
Lawrence Leroy Kneisel - Novi MI
Richard Keith McMillan - Dearborn MI
David James Steinert - Canton MI

Visteon Global Technologies, Inc. - Dearborn MI

F02P 500

12340612, 123477

An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.