Ronald O Allen

6866559, Mar 15, 2005

Feb 4, 2003

10/358107

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies - Milpitas CA

B24B049/12

451 8, 451 6, 451 41

Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad are provided. One window includes a first portion and a second portion. The first portion includes a first material, and the second portion includes a second material different than the first. Another window includes a substantially transparent gel. In some instances, the gel includes a triblock copolymer and a plasticizing oil. An additional window includes an upper window, a housing, and a diaphragm. The housing may allow a fluid to flow into and out of a space between the housing and the diaphragm. In another embodiment, a window includes a layer of material coupled to lateral surfaces of the window. In some cases, the window may be disposed within an opening in a polishing pad, and movement of the window within the polishing pad may compress the layer of material.

6884146, Apr 26, 2005

Feb 4, 2003

10/358105

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

B24D049/00

451 5, 451 6, 451 8, 451 9, 451 41, 451285, 451286, 451287, 451288, 438 14, 438 15, 438 16, 438 17

Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.

6935922, Aug 30, 2005

Feb 4, 2003

10/358106

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

B24D049/00

451 5, 451 6, 451 8, 451 9, 451 41, 451285, 451286, 451287, 451288, 438 14, 438 15, 438 16, 438 17

Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.

7030018, Apr 18, 2006

Feb 4, 2003

10/358101

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

H01L 21/302

438692, 438 8, 438689

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

7052369, May 30, 2006

Feb 4, 2003

10/358104

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

B24B 49/00

451 9, 451 5

Systems and methods for detecting a presence of blobs on a specimen are provided. One method may include scanning measurement spots across a specimen during polishing of the specimen. The method may also include determining if the blobs are present on the specimen at the measurement spots. Each of the blobs may include unwanted material disposed upon a contiguous portion of the measurement spots. In some instances, the blobs may include copper. In some embodiments, scanning the measurement spots may include measuring an optical property and/or an electrical property of the specimen at the measurement spots. Another embodiment includes dynamically determining a signal threshold distinguishing a presence of the blobs from an absence of the blobs. An additional embodiment includes determining an endpoint of polishing if, for example, blobs are not determined to be present on the specimen.

7175503, Feb 13, 2007

Feb 4, 2003

10/358069

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

B24B 49/00
B24B 51/00

451 5, 451 8, 451 41, 451 6, 438 17

Systems and methods for characterizing polishing of a specimen are provided. One method includes scanning a specimen with an eddy current device during polishing to generate output signals at measurement spots across the specimen. The method also includes combining a portion of the output signals generated at the measurement spots located within a zone on the specimen. In addition, the method includes determining a characteristic of polishing within the zone from the combined portion of the output signals. In some instances, a zone may include a predetermined range of radial and azimuthal positions on the specimen. In one embodiment, the method may include determining a characteristic of polishing within more than one zone on the specimen. Some embodiments may include determining an additional characteristic of polishing from the characteristic of polishing within more than one zone on the specimen.

7332438, Feb 19, 2008

Feb 14, 2006

11/353899

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

H01L 21/302

438692, 216 85, 216 88, 451 6, 451 28, 438 7, 438 16

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

8010222, Aug 30, 2011

Feb 15, 2008

12/032112

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

G06F 19/00

700121, 700164, 438692

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.