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Thomas Markley Phones & Addresses

  • 100 Old Woods Rd, Lehighton, PA 18235 (610) 377-5076
  • Bowmanstown, PA
  • Lansford, PA

Work

Position: Craftsman/Blue Collar

Resumes

Resumes

Thomas Markley Photo 1

Thomas Markley

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Skills:
Microsoft Excel
Microsoft Office
Management
Thomas Markley Photo 2

Thomas Markley

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Publications

Us Patents

Acrylic Compounds For Sub-200 Nm Photoresist Compositions And Methods For Making And Using Same

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US Patent:
6919160, Jul 19, 2005
Filed:
Feb 20, 2003
Appl. No.:
10/371251
Inventors:
Atteye Houssein Abdourazak - Allentown PA, US
Thomas John Markley - Blandon PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
G03F007/039
C08F018/20
C07D315/00
US Classification:
4302701, 430907, 430914, 526246, 549417, 549423
Abstract:
Disclosed herein is an acrylic compound that can be polymerized by itself or with at least one other ethylenically unsaturated monomer to provide a polymer. The polymer may be used, for example, within a sub-200 nm photoresist composition. Also disclosed is a method to make the acrylic compound of the present invention from the raw material trifluoroacetone.

Bridged Carbocyclic Compounds And Methods Of Making And Using Same

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US Patent:
7138550, Nov 21, 2006
Filed:
Feb 23, 2004
Appl. No.:
10/784377
Inventors:
Richard Van Court Carr - Allentown PA, US
Thomas John Markley - Blandon PA, US
Atteye Houssein Abdourazak - Allentown PA, US
John Anthony Marsella - Allentown PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
C07C 43/18
C07C 43/188
G03C 1/492
US Classification:
568667, 568669, 568670, 526 72, 549417, 528401, 528402, 430311
Abstract:
Disclosed herein is a fluorinated bridged carbocyclic compound that can be polymerized by itself or with at least one other ethylenically unsaturated monomer to provide a polymer. The polymer may be used, for example, within a sub-300 nm photoresist composition. Also disclosed is a method to make the bridged carbocyclic compound.

Silicone Surfactants For Rigid Polyurethane Foam Made With Hydrocarbon Blowing Agents

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US Patent:
7183330, Feb 27, 2007
Filed:
Dec 15, 2003
Appl. No.:
10/736042
Inventors:
Wayne Robert Furlan - Hellertown PA, US
Mark Leo Listemann - Kutztown PA, US
Thomas John Markley - Blandon PA, US
Gary Dale Andrew - Walnutport PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
C08J 9/14
C08G 77/46
US Classification:
521112, 521114, 521128, 521129, 521130, 521131, 521170, 521172, 521173, 521174, 521176
Abstract:
A method for making a rigid polyurethane foam by reacting a polyisocyanate and a polyol in the presence of a urethane catalyst, a blowing agent and a silicone surfactant characterized by employing a blowing agent comprising a C4 or C5 hydrocarbon, or mixtures thereof, with an average molecular weight of ≦72 g/mole and a boiling point in the range of 27. 8 to 50 C. , and a silicone surfactant comprising a polyether-polysiloxane copolymer represented by the following formula:(CH)—Si—O—(Si(CH)—O)—(Si(CH)(R)O)—Si(CH)whereR=(CH)—O—(—CH—CH—O)—(CH—CH(CH)—O)—R″, andwhere R″ is H, (CH)CH, or C(O)CH; x+y+2 is 60–130; x/y is 5–14; z is 0–4; the total surfactant molecular weight, based on the formula, is 7000–30,000 g/mole, the wt % siloxane in the surfactant is 32–70 wt %, the blend average molecular weight (BAMW) of the polyether portion is 450–1000 g/mole, and the mole % of ethylene oxide in the polyether portion is 70–100 mole %.

Thin Film Transistors With Poly(Arylene Ether) Polymers As Gate Dielectrics And Passivation Layers

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US Patent:
7919825, Apr 5, 2011
Filed:
May 23, 2007
Appl. No.:
11/752722
Inventors:
Christine Peck Kretz - Macungie PA, US
Thomas John Markley - Blandon PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
H01L 21/02
US Classification:
257410, 257E51007, 257E29273
Abstract:
The use of a poly(arylene ether) polymer as a passivation or gate dielectric layer in thin film transistors. This poly(arylene ether) polymer includes polymer repeat units of the following structure:—(O—Ar—O—Ar—O—)—(—O—Ar—O—Ar—O)—where Ar, Ar, Ar, and Arare identical or different aryl radicals, m is 0 to 1, n is 1−m, and at least one of the aryl radicals is grafted to the backbone of the polymer.

Film Forming Additive Formulations Of Conductive Polymers

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US Patent:
8183319, May 22, 2012
Filed:
Oct 9, 2008
Appl. No.:
12/248098
Inventors:
Thomas John Markley - Blandon PA, US
Michael Scott Lowry - Allentown PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
C08L 27/18
US Classification:
524545, 524500, 524501, 524520, 524609, 524817, 525535, 136263, 313507
Abstract:
An aqueous dispersion including a partially fluorinated dispersant, an electrically conductive polymer and a film forming additive. The film forming additive includes a boiling temperature greater than about 85 C. (185 F. ). In addition, the concentration of the film forming additive is less than the solubility limit of the additive in water. The dynamic surface tension of the dispersion including the film forming additive is less than about 60 dynes/cm at 100 ms surface age. A method for making an electrically conductive polymer film and devices including electrically conductive polymer film are also disclosed.

Photodefinable Low Dielectric Constant Material And Method For Making And Using Same

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US Patent:
20070299176, Dec 27, 2007
Filed:
Jan 27, 2006
Appl. No.:
11/341334
Inventors:
Thomas Markley - Blandon PA, US
Scott Weigel - Allentown PA, US
Christine Kretz - Macungie PA, US
Thomas Braymer - Allentown PA, US
James Mac Dougall - New Tripoli PA, US
Cecilia Petit - Quakertown PA, US
International Classification:
B05D 3/02
B05D 3/06
B60C 1/00
C08L 83/04
US Classification:
524261000, 427387000, 524588000
Abstract:
A photodefinable, organosilicate material having a dielectric constant (κ) of 3.5 or below and a method for making and using same, for example, in an electronic device, is described herein. In one aspect, there is provided a composition for preparing a photodefinable material comprising: a silica source capable of being sol-gel processed and having a molar ratio of carbon to silicon within the silica source contained therein of at least 0.5 or greater; a photoactive compound; optionally a solvent; and water provided the composition contains 0.1% by weight or less of an added acid where the acid has a molecular weight of 500 or less.

Low Temperature Sol-Gel Silicates As Dielectrics Or Planarization Layers For Thin Film Transistors

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US Patent:
20080012074, Jan 17, 2008
Filed:
Jul 5, 2007
Appl. No.:
11/773570
Inventors:
Thomas Braymer - Allentown PA, US
Christine Kretz - Macungie PA, US
Thomas Markley - Blandon PA, US
Scott Weigel - Allentown PA, US
Assignee:
AIR PRODUCTS AND CHEMICALS, INC. - Allentown PA
International Classification:
H01L 27/12
C09D 183/06
US Classification:
257347000, 106287160, 257E27112
Abstract:
Traditionally, sol-gel silicates have been reported as being high temperature processable at 400 C to give reasonably dense films that showed good leakage current densities (

Photoimprintable Low Dielectric Constant Material And Method For Making And Using Same

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US Patent:
20080264672, Oct 30, 2008
Filed:
Apr 26, 2007
Appl. No.:
11/740410
Inventors:
Thomas John Markley - Blandon PA, US
Scott Jeffrey Weigel - Allentown PA, US
Christine Peck Kretz - Macungie PA, US
Assignee:
AIR PRODUCTS AND CHEMICALS, INC. - Allentown PA
International Classification:
H05K 1/00
B29C 35/04
US Classification:
174250, 264401, 524261
Abstract:
A process for preparing a photoimprinted film, a composition for forming a photoimprinted film and a photoimprinted film comprising a dielectric constant of less than about 3.5. The method includes providing a material film having a composition including at least one silica source capable of being sol-gel processed, at least one photoactive compound and at least one solvent; and water. The composition contains less than about 0.1% by weight of an added acid. A mold having mold features is provided. The mold is positioned in sufficient contact with the material film to allow the material to contact at least a portion of the mold features. The material film is then exposed to a radiation source and the film is cured to form a solidified material film. The mold is separated from the solidified material, wherein the material includes film features corresponding to the mold features.
Thomas R Markley from Lehighton, PA, age ~62 Get Report