Search

Andrew Franczek Phones & Addresses

  • 5912 Timber Trl, Plainfield, IL 60586
  • Joliet, IL
  • 576 Kathleen Dr, Romeoville, IL 60446
  • 3336 83Rd St, Woodridge, IL 60517
  • Calumet City, IL
  • Lombard, IL

Work

Position: Production Occupations

Education

Degree: High school graduate or higher

Emails

a***k@tellabs.com

Resumes

Resumes

Andrew Franczek Photo 1

Andrew Franczek Romeoville, IL

View page
Work:
Tellabs Operations, Inc
Naperville, IL
Jan 2002 to Mar 2011
Senior Program/Product Manager

Tellabs Operations, Inc
Lisle, IL
Jul 1999 to Jan 2002
Detail Engineer

Education:
DeVry Institute of Technology
Addison, IL
Jan 1996 to Jan 1999
Bachelor of Science in Telecommunication Management

Skills:
Microsoft Office (Word, Excel, PowerPoint, Project, Visio), EXFO test sets, Central Office environment, Tellabs ROADM 7100, Tellabs Echo Cancellers 3100, 3300, 3600, Tellabs Digital Cross Switches 5500, 5320, Advanced Fiber Testing and Trouble Shooting, PMD, CD and ORL Testing, Fiber Optic Design, Handling, and Maintenance Install, TL 9000, NEBS Mechanical and Installation Quality Requirements, Also possess general automobile mechanic and electrical skills
Andrew Franczek Photo 2

Andrew Franczek Romeoville, IL

View page
Work:
Tellabs Operations, Inc
Naperville, IL
2009 to 2011
Senior Program/Product Manager

Tellabs Operations, Inc

2007 to 2009
Lead Planning Engineer

Tellabs Operations, Inc

2002 to 2007
Planning Engineer

Tellabs Operations, Inc

2001 to 2002
Detail Engineer

Tellabs Operations, Inc
Lisle, IL
1999 to 2001
Associate Detail Engineer

Education:
DeVry Institute of Technology
Addison, IL
1999
Bachelor of Science in Telecommunication Management

Publications

Us Patents

Electronics Assembly Divider Plate

View page
US Patent:
20130163209, Jun 27, 2013
Filed:
Dec 23, 2011
Appl. No.:
13/336622
Inventors:
Scott A. Blakemore - Warrenville IL, US
Andrew M. Franczek - Romeoville IL, US
Zongxian Duan - Shanghai, CN
Qingzhen Ba - Shanghai, CN
Assignee:
Tellabs Operations, Inc. - Naperville IL
International Classification:
H05K 1/02
H05K 3/00
US Classification:
361736, 29842
Abstract:
Small form-factor pluggable (SFP) ports are often employed in telecommunications hardware to take advantage of their lower profile and to provide connections to other network elements. The use of SFP ports has increased the density of ports possible for a given circuit board size, but this increase has previously meant that individual ports are difficult to access. Also, identification of those ports is frustrated by a lack of free space to place labeling. Example embodiments of the present invention address these issues by placing a divider plate between columns of SFP ports that provides surface area adjacent to the SFP ports for affixing labeling. The divider plate is offset from the SFP ports to allow access when the plate is installed. As a result, hardware employing embodiments of the present invention can achieve a higher density of SFP ports with ease of access by personnel assembling or servicing the hardware.
Andrew M Franczek from Plainfield, IL, age ~47 Get Report