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Bangalore R Natarajan

from Cupertino, CA
Age ~71
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Also known as:
Bangalore Padmini Natarajan, Bangalore Padmin Natarajan, Bangalore R Natrajan, Natarajan Bangalore
Phone and address:
21450 Columbus Ave, Cupertino, CA 95014
(408) 252-3608
Related to:
Lita S Chernick, 95Gregory Pesich, 60Mark A Mcarthur, 67Geoffrey A Martin, 52
Connected to:
Asha Natarajan, 55Balasubra Natarajan, 53Chitralega Natarajan, 42Gokul K Natarajan, 40Kannan N Natarajan, 67Kumaresan Natarajan, 53Mohit Nataraj, 34Muralidhar Natarajan, 48Muthaiah Natarajan, 56Muthukumaran Natarajan, 37

Bangalore Natarajan Phones & Addresses

  • 21450 Columbus Ave, Cupertino, CA 95014 (408) 252-3608 (408) 253-1627 (408) 253-1920
  • Palo Alto, CA
  • Fremont, CA
  • San Jose, CA
  • Urbana, IL
  • 21450 Columbus Ave, Cupertino, CA 95014 (408) 253-8388

Work

Position: Precision Production Occupations

Education

Degree: Bachelor's degree or higher

Emails

b***[email protected]

Business Records

Name / Title
Company / Classification
Phones & Addresses
Bangalore R. Natarajan
Managing
Padmini Natarajan, LLC
Consulting/Services · Nonclassifiable Establishments
21450 Columbus Ave, Cupertino, CA 95014

Publications

Us Patents

Packaging A Mems Device Using A Frame

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US Patent:
7715080, May 11, 2010
Filed:
Apr 13, 2007
Appl. No.:
11/735362
Inventors:
Bangalore R. Natarajan - Cupertino CA, US
Lauren Palmateer - San Francisco CA, US
Assignee:
QUALCOMM MEMS Technologies, Inc. - San Diego CA
International Classification:
G02F 1/03
G02B 26/00
US Classification:
359245, 359290
Abstract:
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.

Mems Cavity-Coating Layers And Methods

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US Patent:
7733552, Jun 8, 2010
Filed:
Mar 21, 2007
Appl. No.:
11/689430
Inventors:
Ana R. Londergan - Santa Clara CA, US
Bangalore R. Natarajan - Cupertino CA, US
Evgeni Gousev - Saratoga CA, US
James Randolph Webster - San Jose CA, US
David Heald - Solvang CA, US
Assignee:
Qualcomm Mems Technologies, Inc - San Diego CA
International Classification:
G02F 1/00
US Classification:
359237
Abstract:
Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties.

Electromechanical Device Treatment With Water Vapor

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US Patent:
7738158, Jun 15, 2010
Filed:
Jun 27, 2008
Appl. No.:
12/163660
Inventors:
Bangalore R. Natarajan - Cupertino CA, US
Kasra Khazeni - San Jose CA, US
David Heald - Solvang CA, US
Rihui He - San Jose CA, US
Sriram Akella - San Jose CA, US
Evgeni Gousev - Saratoga CA, US
Assignee:
QUALCOMM MEMS Technologies, Inc. - San Diego CA
International Classification:
G02B 26/00
G02F 1/03
US Classification:
359290, 359247
Abstract:
Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.

Mems Devices And Processes For Packaging Such Devices

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US Patent:
7746537, Jun 29, 2010
Filed:
Apr 12, 2007
Appl. No.:
11/734730
Inventors:
Bangalore R. Natarajan - Cupertino CA, US
Surya Ganti - Los Altos CA, US
Assignee:
QUALCOMM MEMS Technologies, Inc. - San Diego CA
International Classification:
G02B 26/00
US Classification:
359290, 359292
Abstract:
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal.

Mems Processing

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US Patent:
7816164, Oct 19, 2010
Filed:
Dec 1, 2006
Appl. No.:
11/566172
Inventors:
Manish Kothari - Cupertino CA, US
Fritz Y. F. Su - Hsin Chu Country, TW
Bangalore Natarajan - Cupertino CA, US
Nassim Khonsari - Redwood City CA, US
Assignee:
QUALCOMM MEMS Technologies, Inc. - San Diego CA
International Classification:
H01L 21/00
US Classification:
438 48
Abstract:
Methods for forming a MEMS display device are provided. In one embodiment, a transparent substrate comprising an array of MEMS devices (e. g. , interferometric modulators) formed thereon is annealed following removal of a sacrificial silicon layer. The array is subsequently encapsulated with a backplate comprising a desiccant. MEMS devices disposed below the desiccant have an offset voltage substantially equal to zero.

Integrated Touch For Imod Displays Using Back Glass

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US Patent:
8149496, Apr 3, 2012
Filed:
Dec 22, 2009
Appl. No.:
12/645379
Inventors:
Manish Kothari - Cupertino CA, US
Bangalore Ramaswamiengar Natarajan - Cupertino CA, US
Alok Govil - Santa Clara CA, US
Kristopher Andrew Lavery - San Jose CA, US
Lauren Fay Palmateer - San Francisco CA, US
Jonathan Charles Griffiths - Fremont CA, US
Assignee:
Qualcomm Mems Technologies, Inc. - San Diego CA
International Classification:
G02B 26/00
G02B 26/08
US Classification:
359291, 359237, 359298, 359302
Abstract:
An interferometric modulator (“IMOD”) display utilizes ambient light and incorporates touch sensing without reducing the amount of ambient light that reaches the MEMS modulators, and without introducing any optical distortion or loss of performance. Electrodes for touch sensing are located at a back glass of the inteferometric display, and are used in conjunction with electrodes whose primary function is to activate the pixels of the MEMS display, in order to sense a touch. The touch deflects the IMOD layers and is sensed through the various display layers at the rear of the display.

Mems Cavity-Coating Layers And Methods

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US Patent:
8164815, Apr 24, 2012
Filed:
Jun 7, 2010
Appl. No.:
12/795294
Inventors:
Ana R. Londergan - Santa Clara CA, US
Bangalore R. Natarajan - Cupertino CA, US
Evgeni Gousev - Saratoga CA, US
James Randolph Webster - San Jose CA, US
David Heald - Solvang CA, US
Assignee:
Qualcomm Mems Technologies, Inc. - San Diego CA
International Classification:
G02F 1/00
US Classification:
359237
Abstract:
Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties.

Display Device With Desiccant

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US Patent:
8410690, Apr 2, 2013
Filed:
Feb 13, 2009
Appl. No.:
12/371302
Inventors:
Bangalore R. Natarajan - Cupertino CA, US
Evgeni Gousev - Saratoga CA, US
Kristopher A. Lavery - San Jose CA, US
Assignee:
QUALCOMM MEMS Technologies, Inc. - San Diego CA
International Classification:
B01J 20/00
US Classification:
313512, 502400
Abstract:
Systems and methods for providing MEMS devices with integrated desiccant are provided. In one embodiment, a dry composition comprising desiccant is impact sprayed onto the backplate or substrate of a MEMS device, and becomes fused with the substrate. In another embodiment, the desiccant is impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet another embodiment, the impact-sprayed surface is impregnated with the desiccant. In still another embodiment, the desiccant is combined with a suitable inorganic binder, then impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet a further embodiment, the desiccant is micronized or pulverized into a powder of desired particle size, and then impact sprayed onto a surface. Thus, the desiccant particles or powder are fused onto the target surface through the impact spraying process.
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Bangalore R Natarajan from Cupertino, CA, age ~71 Get Report