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Benjamin Mckee Phones & Addresses

  • Phoenix, AZ
  • Glendale, AZ
  • Anchorage, AK
  • Birmingham, AL
  • La Mesa, CA

Work

Address: 8144 E Cactus Rd, Scottsdale, AZ 85260 Specialities: Nurse Practitioner

Languages

English

Specialities

Nurse Anesthesiology

Professional Records

Medicine Doctors

Benjamin Mckee Photo 1

Benjamin R Mckee, Scottsdale AZ - CRNA (Certified registered nurse anesthetist)

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Specialties:
Nurse Anesthesiology
Address:
8144 E Cactus Rd Suite 800, Scottsdale, AZ 85260
(480) 596-8525 (Phone), (480) 596-8522 (Fax)
Languages:
English
Benjamin Mckee Photo 2

Benjamin Ross McKee, Scottsdale AZ

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Specialties:
Nurse Practitioner
Address:
8144 E Cactus Rd, Scottsdale, AZ 85260

Resumes

Resumes

Benjamin Mckee Photo 3

Owner At Ben Mckee Designs

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Location:
Phoenix, Arizona Area
Industry:
Fine Art
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Benjamin Mckee

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Location:
United States
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Benjamin Mckee

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Benjamin Mckee
Owner
McKee Sign Company
Business Consulting
2010 N Lazona Dr, Mesa, AZ 85203

Publications

Us Patents

Integration Scheme For Changing Crystal Orientation In Hybrid Orientation Technology (Hot) Using Direct Silicon Bonded (Dsb) Substrates

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US Patent:
7892908, Feb 22, 2011
Filed:
Dec 24, 2008
Appl. No.:
12/343794
Inventors:
Angelo Pinto - San Diego CA, US
Frank S. Johnson - Wappingers Falls NY, US
Benjamin P. McKee - Richardson TX, US
Shaofeng Yu - Plano TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21/8238
H01L 21/335
US Classification:
438199, 438221, 438233, 438275, 438296, 438424, 257E21633, 257E21618
Abstract:
Optimizing carrier mobilities in MOS transistors in CMOS ICs requires forming ()-oriented silicon regions for NMOS and () regions for PMOS. Methods such as amorphization and templated recrystallization (ATR) have disadvantages for fabrication of deep submicron CMOS. This invention is a method of forming an integrated circuit (IC) which has () and ()-oriented regions. The method forms a directly bonded silicon (DSB) layer of ()-oriented silicon on a ()-oriented substrate. The DSB layer is removed in the NMOS regions and a ()-oriented silicon layer is formed by selective epitaxial growth (SEG), using the substrate as the seed layer. NMOS transistors are formed on the SEG layer, while PMOS transistors are formed on the DSB layer. An integrated circuit formed with the inventive method is also disclosed.

Integration Scheme For Changing Crystal Orientation In Hybrid Orientation Technology (Hot) Using Direct Silicon Bonded (Dsb) Substrates

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US Patent:
8558318, Oct 15, 2013
Filed:
Jan 14, 2011
Appl. No.:
13/007098
Inventors:
Angelo Pinto - San Diego CA, US
Frank S Johnson - Wappingers Falls NY, US
Benjamin P McKee - Richardson TX, US
Shaofeng Yu - Plano TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 27/01
H01L 27/12
H01L 29/76
H01L 29/94
H01L 31/062
US Classification:
257369, 257274, 257371, 257351
Abstract:
Optimizing carrier mobilities in MOS transistors in CMOS ICs requires forming (100)-oriented silicon regions for NMOS and (110) regions for PMOS. Methods such as amorphization and templated recrystallization (ATR) have disadvantages for fabrication of deep submicron CMOS. This invention is a method of forming an integrated circuit (IC) which has (100) and (110)-oriented regions. The method forms a directly bonded silicon (DSB) layer of (110)-oriented silicon on a (100)-oriented substrate. The DSB layer is removed in the NMOS regions and a (100)-oriented silicon layer is formed by selective epitaxial growth (SEG), using the substrate as the seed layer. NMOS transistors are formed on the SEG layer, while PMOS transistors are formed on the DSB layer. An integrated circuit formed with the inventive method is also disclosed.
Benjamin S Mckee from Phoenix, AZ, age ~34 Get Report