Bennett D Langsdorf

20140070245, Mar 13, 2014

Oct 9, 2013

14/050001

MATTHEW DONOFRIO - RALEIGH NC, US
BENNETT LANGSDORF - CARY NC, US
THOMAS PLACE - FRANKLINTON NC, US
MICHAEL JOHN BERGMANN - RALEIGH NC, US

CREE, INC. - DURHAM NC

H01L 33/08

257 93, 257 88, 257 99

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.

20210020805, Jan 21, 2021

Oct 2, 2020

17/062119

- Durham NC, US
Matthew Donofrio - Raleigh NC, US
Bennett Langsdorf - Cary NC, US
Thomas Place - Franklinton NC, US
Michael John Bergmann - Raleigh NC, US

H01L 33/08
H01L 33/40
H01L 25/075

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.

20200365782, Nov 19, 2020

Jul 31, 2020

16/944356

- Durham NC, US
Kevin W. Haberern - Cary NC, US
Bennett D. Langsdorf - Cary NC, US
Manuel L. Breva - Morrisville NC, US

H01L 33/60
H01L 25/075
H01L 33/62
H01L 33/46
H01L 33/40
H01L 33/38
H01L 33/08
H01L 27/15

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another to minimize the visibility of the space during operation. The LED chips can also comprise layers structures and compositions that allow improved reliability under high current operation.

20190198734, Jun 27, 2019

Mar 1, 2019

16/290084

- Durham NC, US
KEVIN W. HABERERN - CARY NC, US
BENNETT D. LANGSDORF - CARY NC, US
MANUEL L. BREVA - MORRISVILLE NC, US

H01L 33/60
H01L 25/075
H01L 33/40
H01L 33/46
H01L 33/62
H01L 27/15
H01L 33/08
H01L 33/38

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another to minimize the visibility of the space during operation. The LED chips can also comprise layers structures and compositions that allow improved reliability under high current operation.

20190074407, Mar 7, 2019

Oct 29, 2018

16/173617

- Durham NC, US
Matthew Donofrio - Raleigh NC, US
Bennett Langsdorf - Cary NC, US
Thomas Place - Franklinton NC, US
Michael John Bergmann - Raleigh NC, US

H01L 33/08
H01L 33/40
H01L 25/075

Monolithic LED chips are disclosed comprising a plurality of active regions on submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.

20170309778, Oct 26, 2017

Jul 12, 2017

15/647823

- Durham NC, US
Matthew Donofrio - Raleigh NC, US
Bennett Langsdorf - Cary NC, US
Thomas Place - Franklinton NC, US
Michael John Bergmann - Raleigh NC, US

H01L 33/08
H01L 25/075
H01L 33/40
H01L 33/46

Monolithic LED chips are disclosed comprising a plurality of active regions on submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.

20150249196, Sep 3, 2015

Apr 29, 2015

14/699302

- Durham NC, US
Kevin W. Haberern - Cary NC, US
Bennett D. Langsdorf - Cary NC, US
Manuel L. Breva - Morrisville NC, US

H01L 33/62
H01L 33/08
H01L 33/48
H01L 33/60

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another to minimize the visibility of the space during operation. The LED chips can also comprise layers structures and compositions that allow improved reliability under high current operation.

20150069430, Mar 12, 2015

May 14, 2014

14/120297

- Durham NC, US
Matthew Donofrio - Raleigh NC, US
Kevin W. Haberern - Cary NC, US
Bennett Langsdorf - Cary NC, US
Anoop Mathew - Raleigh NC, US
Harry A. Seibel - Morrisville NC, US
Iliya Todorov - Durham NC, US
Bradley E. Williams - Cary NC, US

H01L 33/50
H01L 27/15

257 89

A phosphor-converted light emitting device includes a light emitting diode (LED) on a substrate, where the LED comprises a stack of epitaxial layers comprising a p-n junction. A wavelength conversion material is in optical communication with the LED. According to one embodiment of the phosphor-converted light emitting device, a selective filter is adjacent to the wavelength conversion material, and the selective filter comprises a plurality of nanoparticles for absorbing light from the LED not down-converted by the wavelength conversion material. According to another embodiment of the phosphor-converted light emitting device, a perpendicular distance between a perimeter of the LED on the substrate and an edge of the substrate is at least about 24 microns. According to another embodiment of the phosphor-converted light emitting device, the LED comprises a mirror layer on one or more sidewalls thereof for reducing light leakage through the sidewalls.