Inventors:
Jonathan W. Goodwin - Braintree MA
Chuanlong Yue - North Attleboro MA
Curtis G. Knaub - North Attleboro MA
Assignee:
Tyco Electronics Corporation - Middletown PA
International Classification:
H05K 900
US Classification:
361816, 361818, 361704, 361709, 361800, 174 35 R, 174 35 MS, 174 35 GC, 257717, 257718, 257719
Abstract:
An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.