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Clifford Raymond Berry

from West Linn, OR
Age ~72
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Also known as:
Clifford R Berry, Clifford I Berry, Cliff R Berry, Clifford R Erry, Berry I Cliff, Berry Clifford
Phone and address:
3945 Northhampton Ct, West Linn, OR 97068
Related to:
Donald Lee Thomas, 86Kathrynelizabeth Berry, 27Charlene Berry, 67Marion A Berry, 71George KrekelerMichele Berry, 65Kathryn M Berry, 62
Connected to:
Adela Berry, 97Aja W Berry, 28Akil K Berry, 30Alec E Berry, 96Allison R Berry, 40Alora J Berry, 34Andrea S Berry, 44Andrell M Berry, 56Arvin Berry, 28Arwillia B Berry, 75

Clifford Berry Phones & Addresses

  • 3945 Northhampton Ct, West Linn, OR 97068
  • Fremont, CA
  • Sunnyvale, CA
  • San Jose, CA
  • Everett, WA
  • San Diego, CA
  • La Jolla, CA

Resumes

Resumes

Clifford Berry Photo 1

Account Manager

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Work:

Account Manager
Clifford Berry Photo 2

Clifford Berry

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Publications

Us Patents

Pulse Sequence For Plating On Thin Seed Layers

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US Patent:
8500983, Aug 6, 2013
Filed:
May 24, 2010
Appl. No.:
12/786329
Inventors:
Thomas A. Ponnuswamy - Sherwood OR, US
Bryan Pennington - Sherwood OR, US
Clifford Berry - West Linn OR, US
Bryan L. Buckalew - Tualatin OR, US
Steven T. Mayer - Lake Oswego OR, US
Assignee:
Novellus Systems, Inc. - Fremont CA
International Classification:
C25D 5/18
C25D 7/12
US Classification:
205104, 205103, 205123
Abstract:
A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the plating solution. In certain embodiments, the current density of the wafer is constant during immersion. In a specific example, potentiostatic control is employed to produce a current density in the range of about 1. 5 to 20 mA/cm2. The immersion step is followed by a high current pulse step. During bottom up fill inside the features of the wafer, a constant current or a current with a micropulse may be used. This protocol may protect the seed from corrosion while enhancing nucleation during the initial stages of plating.

Digital Data Storage Tape Formatter

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US Patent:
53594681, Oct 25, 1994
Filed:
Aug 6, 1991
Appl. No.:
7/740755
Inventors:
Edward J. Rhodes - San Jose CA
Daryl K. Adams - San Jose CA
Clifford R. Berry - Fremont CA
Ta-Lin Chang - Cupertino CA
David R. Lee - San Jose CA
Assignee:
R-Byte, Inc. - San Jose CA
International Classification:
G11B 509
US Classification:
360 48
Abstract:
In a digital data storage audio tape system having a host device interface unit, a main data buffer manager, a main data buffer, a processor, a data separator, a tape drive unit, and a read/write channel, this invention comprises a formatter providing track construction, encoding and decoding, error correction, and direct memory access of digital data transmitted between the host device unit and the tape drive unit and a frame buffer for buffering digital data for encoding and decoding, and error correction. The formatter is coupled between the main data buffer manager, via a direct memory access channel, and the read/write channel of the tape drive, and further is coupled to the frame buffer. The formatter is coupled to and responsive to instruction control by the processor in conjunction with instruction control of the tape drive unit by the processor.

Monitoring Surface Oxide On Seed Layers During Electroplating

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US Patent:
20190390361, Dec 26, 2019
Filed:
Sep 6, 2019
Appl. No.:
16/562976
Inventors:
- Fremont CA, US
Lee J. Brogan - Newberg OR, US
Tighe A. Spurlin - Portland OR, US
Shantinath Ghongadi - Tigard OR, US
Jonathan David Reid - Sherwood OR, US
Manish Ranjan - Sherwood OR, US
Bryan Pennington - Sherwood OR, US
Clifford Raymond Berry - West Linn OR, US
International Classification:
C25D 21/12
C25D 7/12
C25D 5/34
Abstract:
Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.

Monitoring Surface Oxide On Seed Layers During Electroplating

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US Patent:
20180282894, Oct 4, 2018
Filed:
Mar 30, 2017
Appl. No.:
15/475022
Inventors:
- Fremont CA, US
Lee J. Brogan - Newberg OR, US
Tighe A. Spurlin - Portland OR, US
Shantinath Ghongadi - Tigard OR, US
Jonathan David Reid - Sherwood OR, US
Manish Ranjan - Sherwood OR, US
Bryan Pennington - Sherwood OR, US
Clifford Raymond Berry - West Linn OR, US
International Classification:
C25D 21/12
H01L 21/67
C25D 7/12
C25D 5/34
Abstract:
Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.
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Clifford Raymond Berry from West Linn, OR, age ~72 Get Report