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Dan Hong

from Sugar Land, TX
Age ~45
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Also known as:
Dan H Ong, Thanh Phuoc Phuong, Thanh P Phuong
Related to:
Kim Ngoc Chung, 62Van H Bui, 42Chong AhKaren R Wong, 67Peter Hoang, 39Betty Hoang, 45Mui Hoang, 65
Connected to:
Abraham R Hong, 44Ali S Hong, 33Allyson M Hong, 36Anhhuy N Hong, 31Anping Hong, 70Benita S Hong, 46Beth A Hong, 60Boin S Hong, 38Bonghee Hong, 52Bree A Hong, 70

Dan Hong Phones & Addresses

  • Sugar Land, TX
  • Richmond, TX
  • Houston, TX
  • San Lorenzo, CA
  • 260 Industrial Blvd, Hayward, CA 94544 (510) 733-6755
  • Oakland, CA
  • Union City, CA
  • Alameda, CA
  • 24050 Silva Ave, Hayward, CA 94544 (510) 816-0725

Work

Company: Evernote corporation Aug 2014 Position: Salesforce program manager

Education

School / High School: Oregon State University- Corvallis, OR Dec 2001 Specialities: Bachelor of Science in Management Information System

Resumes

Resumes

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Dan Hong

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Dan Hong

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Dan Hong Photo 3

Dan Hong San Jose, CA

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Work:
Evernote Corporation

Aug 2014 to 2000
SALESFORCE PROGRAM MANAGER
Maxim Integrated
San Jose, CA
2007 to Aug 2014
DATA/SALES/BUSINESS ANALYST
Cardinal Health
Elk Grove, CA
Apr 2006 to Apr 2007
PHARMACY BUSINESS CONSULTANT
Corvallis Mortgage Company
Corvallis, OR
May 2003 to Dec 2006
FINANCIAL MORTGAGE CONSULTANT
Hewlett Packard
Corvallis, OR
1995 to 1996
DATA ANALYST (Intern)
Education:
Oregon State University
Corvallis, OR
Dec 2001
Bachelor of Science in Management Information System

Business Records

Name / Title
Company / Classification
Phones & Addresses
Dan Hong
President
PHO HIEP PHAT, INC
Nonclassifiable Establishments
102-104 Springstowne Ctr, Vallejo, CA 94591
102 Springstowne Ctr, Vallejo, CA 94591
Dan Hong
President
PHO VINH PHAT, INC
508 Contra Costa Blvd STE P, Pleasant Hill, CA 94523
508 Contra Coast Blvd, Concord, CA 94523

Publications

Wikipedia References

Dan Hong Photo 4

Dan Hong

Us Patents

Computer Enclosure

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US Patent:
7310872, Dec 25, 2007
Filed:
Aug 27, 2004
Appl. No.:
10/928780
Inventors:
Michael Kriege - San Jose CA, US
Dan Hong - Sunnyvale CA, US
John DiFonzo - Emerald Hill CA, US
Stephen Zadesky - Redwood City CA, US
David Lynch - Boulder Creek CA, US
David Lundgren - Mill Valley CA, US
Nick Merz - San Carlos CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H01R 43/00
US Classification:
29825, 29832, 29842, 29844, 29855
Abstract:
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Computer Enclosure

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US Patent:
7636244, Dec 22, 2009
Filed:
Dec 29, 2006
Appl. No.:
11/648304
Inventors:
Michael Kriege - San Jose CA, US
Dan Hong - Sunnyvale CA, US
John DiFonzo - Emerald Hill CA, US
Stephen Zadesky - Redwood City CA, US
David Lynch - Boulder Creek CA, US
David Lundgren - Mill Valley CA, US
Nick Merz - San Carlos CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 7/14
H05K 7/18
US Classification:
361800, 361816
Abstract:
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Computer Enclosure

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US Patent:
20020144032, Oct 3, 2002
Filed:
Mar 28, 2001
Appl. No.:
09/821784
Inventors:
Michael Kriege - San Jose CA, US
Dan Hong - Sunnyvale CA, US
John DiFonzo - Emerald Hill CA, US
Stephen Zadesky - Redwood City CA, US
David Lynch - Boulder Creek CA, US
David Lundgren - Mill Valley CA, US
Nick Merz - San Carlos CA, US
Assignee:
Apple Computer, Inc.
International Classification:
G06F013/12
A47B097/00
US Classification:
710/062000, 361/683000, 312/223100
Abstract:
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Composite Structures With Unidirectional Fibers

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US Patent:
20110281044, Nov 17, 2011
Filed:
May 17, 2010
Appl. No.:
12/781761
Inventors:
Spyros Michail - Livermore CA, US
Kevin Kenney - San Jose CA, US
Tommy Tang - Yonghe City, TW
Vinh Diep - Milpitas CA, US
Shannon Hsueh - Taipei, TW
Dan Hong - Los Altos CA, US
International Classification:
B32B 5/26
B32B 5/28
B32B 17/04
B65H 81/00
US Classification:
428 345, 156184, 428 364
Abstract:
Composite structures may be formed using sheets of unidirectional fiber prepreg. Each of the prepreg sheets may include unidirectional fibers such as glass fibers and a binder such as plastic. The prepreg sheets may be wrapped around the outer surface of a drum. Ring-shaped sections of the wrapped sheets may be cut from the drum to form rings of prepreg layers. The prepreg rings may be placed into a mold cavity of a desired shape. While contained in stack of molds, prepreg rings may be cured by applying heat and pressure. Finished composite structures such as ring-shaped composite structures may be released from the molds following curing. The composite structures may be planar structures that have planar upper and lower surfaces and inner and outer edges. The fibers in the finished composite structures may run parallel to the upper and lower surfaces and parallel to the inner and outer edges.
Control profile
Dan Hong from Sugar Land, TX, age ~45 Get Report