US Patent:
20020109251, Aug 15, 2002
Inventors:
David Sellepack - Delton MI, US
International Classification:
B29C051/02
B29C051/12
B29C051/46
B29C041/04
B29C041/20
US Classification:
264/040300, 264/503000, 264/516000, 264/247000, 264/102000, 264/553000, 264/310000
Abstract:
A method for forming a three dimensional polymeric structure includes providing at least one paint layer and providing a bonding layer coupled to the at least one paint layer to form an insert having a bonding surface provided by the bonding layer. A mold having a hollow interior bounded by an interior surface is further provided. The insert is positioned within the interior along a portion of the interior surface. At least one charge of thermoplastic material is deposited into the interior. The interior is heated while the mold is rotated and rocked. As a result, the thermoplastic material melts and is deposited against the interior surface of the mold and against the bonding surface of the insert to form a three dimensional structure within the interior. The three dimensional structure is then removed from the interior of the mold.