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Delphine Anne Patterson

from Sparta, NJ
Age ~42

Delphine Patterson Phones & Addresses

  • 32 Mount Pleasant Rd, Sparta, NJ 07871
  • Seaside Heights, NJ
  • Sandyston, NJ
  • Riverdale, NJ
  • East Rutherford, NJ
  • Delran, NJ
  • Florham Park, NJ
  • Kinnelon, NJ
  • Northvale, NJ
  • Morgan, NJ

Resumes

Resumes

Delphine Patterson Photo 1

Project Manager

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Location:
32 Mount Pleasant Rd, Sparta, NJ 07871
Industry:
Medical Devices
Work:
Stryker
Project Manager
Delphine Patterson Photo 2

Delphine Patterson

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Publications

Us Patents

Implant Package

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US Patent:
20110155592, Jun 30, 2011
Filed:
Dec 29, 2009
Appl. No.:
12/655369
Inventors:
Katherine Liccardo - Morris Plains NJ, US
Delphine Patterson - East Rutherford NJ, US
Joseph Wilmot - Rathkeale, IE
Sarah Grare - South Plainfield NJ, US
Assignee:
Howmedica Osteonics Corp. - Mahwah NJ
International Classification:
B65D 81/24
US Classification:
206210
Abstract:
A packaging assembly includes a substantially rigid base having a cavity dimensioned to receive a medical implant, a sleeve positioned in the cavity of the substantially rigid base and defining an opening dimensioned to receive the medical implant, and a skin pack lid sealed over the substantially rigid base to enclose and secure the sleeve within the cavity of the substantially rigid base. The sleeve has a shape substantially similar to a shape of the medical implant and substantially envelopes the medical implant when the medical implant is positioned in the opening of the sleeve. The skin pack lid has a geometry that substantially conforms to the shape of the sleeve.

Implant Package

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US Patent:
20120191203, Jul 26, 2012
Filed:
Apr 3, 2012
Appl. No.:
13/438302
Inventors:
Katherine Liccardo - Morris Plains NJ, US
Delphine Patterson - East Rutherford NJ, US
Joseph Wilmot - Rathkeale, IE
Sarah Grare - Washington NJ, US
Assignee:
HOWMEDICA OSTEONICS CORP. - Mahwah NJ
International Classification:
A61F 2/40
A61F 2/38
A61B 19/02
US Classification:
623 1911, 206438, 623 2035
Abstract:
A system for packaging a medical implant may include a sleeve for housing the implant within a cavity in the sleeve, with at least a portion of the cavity conforming to the shape of the implant. A flexible material film may cover and substantially conform to the shape of the sleeve so as to aid in stabilizing the sleeve and implant within an outer package. An insertion instrument for inserting the implant within the body of a patient may also be provided with the system. In some embodiments, the sleeve, with the implant inserted in the cavity of the sleeve, is configured for manipulation by a user without contacting the implant, and the implant is connectable to the insertion instrument while in the sleeve.

Implant Package

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US Patent:
20140046451, Feb 13, 2014
Filed:
Oct 3, 2013
Appl. No.:
14/045194
Inventors:
Delphine Patterson - East Rutherford NJ, US
Joseph Wilmot - Rathkeale, IE
Sarah Grare - Washington NJ, US
Assignee:
HOWMEDICA OSTEONICS CORP. - Mahwah NJ
International Classification:
A61F 2/00
US Classification:
623 1914, 623 2035
Abstract:
A system for packaging a medical implant may include a sleeve for housing the implant within a cavity in the sleeve, with at least a portion of the cavity conforming to the shape of the implant. A flexible material film may cover and substantially conform to the shape of the sleeve so as to aid in stabilizing the sleeve and implant within an outer package. An insertion instrument for inserting the implant within the body of a patient may also be provided with the system. In some embodiments, the sleeve, with the implant inserted in the cavity of the sleeve, is configured for manipulation by a user without contacting the implant, and the implant is connectable to the insertion instrument while in the sleeve.
Delphine Anne Patterson from Sparta, NJ, age ~42 Get Report