Detlef Pabst

20100305737, Dec 2, 2010

May 27, 2009

12/472624

Richard P. Good - Austin TX, US
J. Broc Stirton - Austin TX, US
Detlef Pabst - Austin TX, US

G06F 17/00

700105, 700110

A method for estimating a state of a process implemented by a tool for fabricating workpieces includes collecting metrology data associated with a subset of workpieces processed in the tool. The collecting exhibits an irregular pattern. Metrology data associated with a selected state observation is received for a selected run of the process. A tuning factor for the selected run is determined based on the irregular pattern. The selected state observation is discounted based on the determined tuning factor. A state estimate of the process is determined based on the discounted selected state observation. At least one process tool operable to implement the process is controlled based on the state estimate.

20160126120, May 5, 2016

Nov 3, 2014

14/530947

- Grand Cayman, KY
Gero Grau - Dresden, DE
William Fosnight - Saratoga Springs NY, US
Detlef Pabst - Saratoga Springs NY, US

H01L 21/67
G05B 19/418
H01L 21/677

Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method for fabricating semiconductors utilizing a semiconductor fabrication system includes performing a semiconductor fabrication process on a first lot of unprocessed semiconductor substrates with a semiconductor fabrication equipment unit to form a first lot of processed substrates and communicating processing data regarding the first lot of processed substrates from the semiconductor fabrication equipment unit to a just-in-time (JIT) module of the semiconductor fabrication system. The method further includes determining a processing priority of the first lot of processed substrates and a processing priority of a second lot of unprocessed substrates at the JIT module and scheduling removal of the first lot of processed substrates from the semiconductor fabrication equipment unit and delivery of the second lot of unprocessed substrates to the semiconductor fabrication equipment unit by the JIT module based on the processing data and the priority of one or both of the first lot of processed substrates and the second lot of unprocessed substrates.

20150162180, Jun 11, 2015

Dec 9, 2013

14/100610

- Grand Kayman, KY
Steffen Kalisch - Radebeu, DE
Joerg Weigang - Dresden, DE
William John Fosnight - Saratoga Springs NY, US
Chinmay Oza - Mechanicville NY, US
Detlef Pabst - Saratoga Springs NY, US

GLOBALFOUNDRIES Inc. - Grand Kayman

H01L 21/02

A method includes processing each of a plurality of lots with at least one first equipment and moving some of the plurality of lots to a first storage. For each of a plurality of second equipments, an expected dispatch time of one or more next lots for processing by the second equipment is determined Each of the lots in the first storage is assigned to one of the plurality of second equipments on the basis of at least the determined expected dispatch times and moved to one of a plurality of second storages that is associated with one of the plurality of second equipments to which the respective lot was assigned. For each of the plurality of second equipments, each of the lots in the second storage associated with the second equipment is moved to the second equipment and are processed with the second equipment.