Inventors:
Li Hou - Cupertino CA, US
Qunhua Wang - San Jose CA, US
Edwin Sum - Danville CA, US
John White - Hayward CA, US
International Classification:
C23C016/00
H01L021/00
Abstract:
In a first aspect, a method is provided for use during plasma processing. The first method includes the steps of (1) placing a substrate on a substrate holder of a plasma chamber; (2) positioning a cover frame adjacent and below a perimeter of the substrate; and (3) employing the cover frame to reduce arcing during plasma processing within the plasma chamber. Numerous other aspects are provided.