Hal N Kurkowski

6438502, Aug 20, 2002

Oct 31, 2000

09/703456

James D. Awtrey - Garland TX
Hal Kurkowski - Dallas TX
Robert D. Lee - Denton TX

Dallas Semiconductor Corporation - Dallas TX

G01K 524

702130, 374163

A device and method for measuring temperature is disclosed. The device, for example, can include a thermocouple configured to generate a voltage indicative of a junction temperature; a memory device configured to store a unique device ID and to store data; a logic unit connected to the thermocouple and the memory device; an I/O interface connected to the logic unit, the I/O interface configured to communicate with a computer system; and an internal temperature sensor connected to the logic unit, the internal temperature sensor configured to determine a cold junction temperature.

6587807, Jul 1, 2003

Jul 23, 2002

10/201355

James D. Awtrey - Garland TX
Hal Kurkowski - Dallas TX
Robert D. Lee - Denton TX

Dallas Semiconductor Corporation - Dallas TX

G01K 100

702130, 73766

A device and method for measuring temperature is disclosed. The device, for example, can include a thermocouple configured to generate a voltage indicative of a junction temperature; a memory device configured to store a unique device ID and to store data; a logic unit connected to the thermocouple and the memory device; an I/O interface connected to the logic unit, the I/O interface configured to communicate with a computer system; and an internal temperature sensor connected to the logic unit, the internal temperature sensor configured to determine a cold junction temperature.

6986057, Jan 10, 2006

Aug 22, 2000

09/644031

James P. Cusey - McKinney TX, US
Hal Kurkowski - Dallas TX, US

Dallas Semiconductor Corporation - Dallas TX

H04L 9/00
H04L 9/32
H04K 1/00
G06F 11/30
G06F 12/14

713200, 713161, 713189

A security device is disclosed. In one embodiment, the security device includes a memory device comprising having a first memory portion configured to store a device ID; and a second memory portion configured to store a device secret. The security device further includes a processor connected to the memory device wherein the processor is configured to read the stored device ID from the first memory portion and the stored device secret from the second memory portion and perform a nonreversible computation using the stored device ID, the stored device secret, and a challenge as seeds. Additionally, the security device includes a communication circuit connected to the processor, the communication circuit configured to receive the challenge from a host device and to communicate a result of the nonreversible computation performed by the processor.

7675166, Mar 9, 2010

May 11, 2005

11/128052

Jeff Alan Gordon - Dallas TX, US
Steven N. Hass - Dallas TX, US
Hal Kurkowski - Dallas TX, US
Scott Jones - Highland Village TX, US

Maxim Integrated Products, Inc. - Sunnyvale CA

H01L 23/34

257726, 257727, 257687, 257693

An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e. g. , a printer). Further, the integrated circuit package may be hosted by a peripheral device (e. g.

8338955, Dec 25, 2012

Apr 5, 2007

11/697260

Jeff Alan Gordon - Dallas TX, US
Steven Hass - Dallas TX, US
Hal Kurkowski - Dallas TX, US
Scott Jones - Highland Village TX, US

Maxim Integrated Products, Inc. - San Jose CA

H01L 23/48

257773, 257727, 257693, 257687

An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e. g. , a printer). Further, the integrated circuit package may be hosted by a peripheral device (e. g.

20020018513, Feb 14, 2002

Apr 6, 2001

09/827825

Stephen Curry - Dallas TX, US
Michael Bolan - Dallas TX, US
Kevin Deierling - Dallas TX, US
William Payne - Garland TX, US
Hal Kurkowski - Dallas TX, US
Donald Dias - Carrollton TX, US
Gary Zanders - Dallas TX, US
Robert Lee - Denton TX, US
Guenter Lehmann - The Colony TX, US

Dallas Semiconductor Corporation

G01K007/00
G01K007/01

374/178000, 374/163000, 374/170000

Serial bus modules with unique multibit identifications that may be searched with multiple modules on a single bus. Modules may contain temperature history per integrated Arrhenius temperature dependent signal. Modules may be packaged as tokens or as two or three lead plastic plastic, also with the three lead packages further functionality as sensors or switches may be incorporated into the modules.

20050268099, Dec 1, 2005

Jul 7, 2005

11/176620

James Cusey - McKinney TX, US
Hal Kurkowski - Dallas TX, US

H04L009/00

713168000

A security device is disclosed. In one embodiment, the security device includes a memory device comprising having a first memory portion configured to store a device ID; and a second memory portion configured to store a device secret. The security device further includes a processor connected to the memory device wherein the processor is configured to read the stored device ID from the first memory portion and the stored device secret from the second memory portion and perform a nonreversible computation using the stored device ID, the stored device secret, and a challenge as seeds. Additionally, the security device includes a communication circuit connected to the processor, the communication circuit configured to receive the challenge from a host device and to communicate a result of the nonreversible computation performed by the processor.

62172131, Apr 17, 2001

May 26, 1998

9/084516

Stephen M. Curry - Dallas TX
Michael L. Bolan - Dallas TX
Kevin E. Deierling - Dallas TX
William Lee Payne - Garland TX
Hal Kurkowski - Dallas TX

Dallas Semiconductor Corporation - Dallas TX

G01K 304

374178

A temperature-controlled counter/clock arrangement is provided where th rate or frequency of the counting is temperature dependent. This allows for a measuring of thermal accumulation and/or history. The temperature sensing is based upon the use of the varying current that will flow through a toward biased semiconductor diode. In one embodiment a constant voltage source is used so that the current variation will follow Arrhenius's law.