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Horst F Irmscher

from Corvallis, OR
Age ~88

Horst Irmscher Phones & Addresses

  • 3240 NW Lynwood Cir, Corvallis, OR 97330 (541) 757-1997
  • 3240 NW Lynwood Cir, Corvallis, OR 97330

Work

Position: Retired

Education

Degree: High school graduate or higher

Publications

Us Patents

Heat Conductive Substrate Press-Mounted In Pc Board Hole For Transferring Heat From Ic To Heat Sink

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US Patent:
60181931, Jan 25, 2000
Filed:
Jun 28, 1999
Appl. No.:
9/343161
Inventors:
Paul A. Rubens - Salem OR
Charlie W. Gilson - Philomath OR
Brian G. Spreadbury - Corvallis OR
Horst F. Irmscher - Corvallis OR
Tim J. Jondrow - Corvallis OR
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H01L 2334
US Classification:
257720
Abstract:
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.

Heat Conductive Substrate Press-Mounted In Pc Board Hole For Transferring Heat From Ic To Heat Sink

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US Patent:
59605359, Oct 5, 1999
Filed:
Oct 28, 1997
Appl. No.:
8/958954
Inventors:
Paul A. Rubens - Salem OR
Charlie W. Gilson - Philomath OR
Brian G. Spreadbury - Corvallis OR
Horst F. Irmscher - Corvallis OR
Tim J. Jondrow - Corvallis OR
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 330
US Classification:
29832
Abstract:
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.
Horst F Irmscher from Corvallis, OR, age ~88 Get Report