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Janos Legrady

from Putnam Valley, NY
Age ~61
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Related to:
Nicki LegradyAgnes LegradyJonas LegradyNicholas J Legrady, 34Maria LegradyAlexandra Legrady, 76
Connected to:
Pam A Legraff, 65Anne C Legrain, 35Hillary P Legrain, 45Nicole L Legrair, 37Ali M Legrand, 39Becky J Legrande, 65Beth M Legrand, 47Buddy L Legrand, 56Cartouche L Legrande, 30Cecil Legrande, 35

Janos Legrady Phones & Addresses

  • Putnam Valley, NY
  • Tuckahoe, NY
  • Chester, SC
  • Kissimmee, FL

Resumes

Resumes

Janos Legrady Photo 1

Vice President

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Location:
456 Oscawana Lake Rd, Putnam Valley, NY 10579
Industry:
Electrical/Electronic Manufacturing
Work:
Zierick Manufacturing
Vice President
Janos Legrady Photo 2

Vice President R And D

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Location:
Putnam Valley, NY
Industry:
Electrical/Electronic Manufacturing
Work:
Zierick Manufacturing
Vice President R and D
Education:
Budapest University of Technology and Economics
New York Institute of Technology
Masters

Publications

Us Patents

Capillary Action Enhanced Surface Mount Pin Header

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US Patent:
6402531, Jun 11, 2002
Filed:
Oct 5, 1998
Appl. No.:
09/166632
Inventors:
Janos Legrady - Putnam Valley NY
Assignee:
Zierick Manufacturing Corp. - Mount Kisco NY
International Classification:
H01R 1200
US Classification:
439 83, 439876
Abstract:
A capillary action enhanced surface mount pin header includes a first flat substrate provided with a predetermined array of plated-through holes having substantially parallel and each having an internal surface defining a first substantially uniform cross section. Pins are provided each of which defines a longitudinal axis and having one end extending through an associated plated-through hole and another end extending to one side of said first substrate. Each pin has an external surface on at least a portion thereof which is received within an associated plated-through hole which defines a second substantially uniform cross section. In the disclosed embodiment, the pins have square or hexagonal cross sections while the plated-through holes have circular cross sections. The first and second cross sections are dissimilar and configured to provide spaced lines of contact and elongate channels substantially parallel to the axes between the internal and external surfaces and adjacent lines of contact, dimensioned to promote capillary action for molten solder at a channel opening on one side of the first substrate to cause the solder to be drawn through the channels towards the opposite side of the first substrate. A second substantially flat substrate is provided for positioning the solder at points substantially aligned with points on the predetermined array and proximate to at least one channel in at least one plated-through hole prior to melting of the solder.

Compliant Surface Mount Electrical Contacts For Circuit Boards And Method Of Making And Using Same

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US Patent:
6997727, Feb 14, 2006
Filed:
Mar 14, 2003
Appl. No.:
10/388570
Inventors:
Janos Legrady - Putnam Valley NY, US
William L. Woods - Kaufman TX, US
Clifton L. Lindsey - Rockwall TX, US
Thang D. Truong - Grand Prairie TX, US
Jon P. Martin - Rockwall TX, US
Richard D. Lytle - Plano TX, US
Assignee:
Zierick Manufacturing Corp - Mt. Kisco NY
International Classification:
H01R 13/64
US Classification:
439246, 439 83, 439885, 439874
Abstract:
There is provided electrical contact for circuit boards. Each leg of the pin section has a deformable segment that can expand or contract along the direction of the leg to alleviate stress created by relative movement of printed circuit boards and/or off-board components interconnected thereby. The deformable segments have members that project in opposing directions relative to the direction of the leg, so that the segments are symmetrical. In one embodiment, each leg has a deformable segment having a outwardly curved shape. In another embodiment, each leg has a deformable segment in the shape of a rectangular frame. The deformable segments define at least one opening where the two legs of the pin section are not overlapping, which breaks the capillary flow of solder between the legs. The amount of solder that flows into the electrical contact is selectively controlled by the selected placement of the deformable segments.

Insulation Displacement Connector Assembly And System Adapted For Surface Mounting On Printed Circuit Board And Method Of Using Same

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US Patent:
7320616, Jan 22, 2008
Filed:
Nov 10, 2006
Appl. No.:
11/598247
Inventors:
Janos Legrady - Putnam Valley NY, US
Ronald Fredriks - Pine Plains NY, US
Raffaele Tarulli - Irvington NY, US
Assignee:
Zierick Manufacturing Corp. - Mount Kisco NY
International Classification:
H01R 4/24
H01R 4/26
H01R 11/20
US Classification:
439404, 439 41, 439425
Abstract:
There is provided an insulation displacement connector (IDC) assembly having a main body defining at least one wire channel. The main body has at least one substantially flat surface to which a vacuum nozzle can be affixed in order to pickup the IDC assembly. The IDC assembly has at least one contact member with a piercing, cutting or slicing end that is slideably disposed within the main body, and a mounting end that extends from the main body. The mounting end of the contact is attached to a printed circuit board. An insulated conductor, such as wire, cable, and/or ribbon, can be quickly and easily inserted in the channel without being pierced by the piercing end of the contact. When a user pushes down on the IDC, the contact slides into the channel and pierces the insulated conductor.

Surface Mount Crimp Terminal And Method Of Crimping An Insulated Conductor Therein

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US Patent:
7591666, Sep 22, 2009
Filed:
Nov 10, 2006
Appl. No.:
11/595249
Inventors:
Janos Legrady - Putnam Valley NY, US
Raffaelle Tarulli - Irvington NY, US
Ronald Fredriks - Pine Plains NY, US
Assignee:
Zierick Manufacturing Corporation - Radio Circle, Mount Kisco NY
International Classification:
H01R 4/24
US Classification:
439424
Abstract:
A surface mount insulation terminal is formed of flat deformable conductive member to provide a substantially uniform U-shaped cross-section to form a wire-receiving channel. One or more piercing spikes are formed on a bottom wall of the channel and point to an opposing open side through which a conductor may be introduced. Ribs inside the channel provide an interference fit with a conductor introduced into the channel. A crimping tool lowered into engagement with the terminal after it has been soldered to a PCB increasingly deforms the side walls of the terminal inwardly towards each other and towards the bottom wall to enhance the electrical and mechanical properties of the resulting termination.

Surface Mount (Smt) Crimp Terminal And Method Of Securing Wire To Same

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US Patent:
7955147, Jun 7, 2011
Filed:
Mar 15, 2010
Appl. No.:
12/723758
Inventors:
Janos Legrady - Putnam Valley NY, US
Raffaele Tarulli - Irvington NY, US
Assignee:
Zierick Manufacturing Corporation - Mount Kisco NY
International Classification:
H01R 4/10
US Classification:
439877, 439 83
Abstract:
An surface mount technology (“SMT”) crimp terminal for mounting on printed circuit boards is in the form of a seamless circular tube or cylinder. The method of use includes depositing the SMT crimp terminal on a copper pad or land on a printed circuit board (“PCB”) coated with solder paste to render the pad or land tacky. The solder is reflowed by application of heat and the crimp terminal is soldered to the PCB. A bare wire to be retained is inserted through one end of the tube and the tube is subjected to sufficiently high stress, intermediate its axial ends, to induce plastic flow on the surface of the material. The force plastically deforms the central region of the tube as well as the bare wire received therein. Any form of mechanical hydraulic press can be used for this purpose and resulting deformation of the crimp terminal and the wire contained therein provides a retention force on the wire which is greater than wire breaking strength.

Surface Mount Board-Stacking Connector

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US Patent:
20080113566, May 15, 2008
Filed:
Nov 10, 2006
Appl. No.:
11/598258
Inventors:
Janos Legrady - Putnam Valley NY, US
International Classification:
H01R 4/02
US Classification:
439876, 439875
Abstract:
A board-stacking connector has surface-mounting connections to electrical contact pads or lands on two facing surfaces on two printed circuit boards that are spaced from each other a predetermined distance in two substantially parallel planes. The connector takes the form of a generally cylindrical shell of metallic material and defines an axis and a substantially uniform cross-sectional area along that axis. The shell has a wall closed on itself to define an internal cavity forming two openings, one at each of its axial ends, and this wall further defines generally flat contact surfaces normal to said axis and surrounds each of said respective openings. One of the contact surfaces is arranged to be in contact with a pad or land on one printed circuit board and the other of the contact surfaces is arranged to be in contact with a pad or land on the other spaced printed circuit board. The internal cavity is dimensioned so as to produce capillary action of molten solder on each of the pads or lands that are in contact with the contact surfaces, so that excess solder on the pads or lands is drawn into this cavity, at both axial openings, during reflow soldering.

Surface Mount Crimp Terminal And Method Of Crimping An Insulated Conductor Therein

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US Patent:
20090117774, May 7, 2009
Filed:
Nov 3, 2008
Appl. No.:
12/263877
Inventors:
Janos Legrady - Putnam Valley NY, US
Raffaelle Tarulli - Irvington NY, US
Ronald Fredriks - Pine Plains NY, US
International Classification:
H01R 13/58
H01R 4/24
H01R 43/042
US Classification:
439449, 439404, 29753
Abstract:
A surface mount insulation terminal is formed of flat deformable conductive member to provide a substantially uniform U-shaped cross-section to form a wire-receiving channel. One or more piercing spikes are formed on a bottom wall of the channel and point to an opposing open side through which a conductor may be introduced. Ribs inside the channel provide an interference fit with a conductor introduced into the channel. A crimping tool lowered into engagement with the terminal after it has been soldered to a PCB increasingly deforms the side walls of the terminal inwardly towards each other and towards the bottom wall to enhance the electrical and mechanical properties of the resulting termination.

Surface Mount Electrical Contacts

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US Patent:
56953488, Dec 9, 1997
Filed:
Feb 28, 1995
Appl. No.:
8/395618
Inventors:
Janos Legrady - Putnam Valley NY
Assignee:
Zierick Manufacturing Corporation - Mt. Kisco NY
International Classification:
H01R 909
US Classification:
439 78
Abstract:
A surface mounted contact for surface mounting on a generally flat conductive surface of a printed circuit board includes a base which has a generally flat surface suitable for contact with an attachment to a conductive surface of the printed circuit board. An electrical contact, which may be in the form of a pin, post, IDC, test point, receptacle, or jumper has at least one portion projecting from the base in a direction normal to the base. At least one bent intermediate connecting portion integrally connects the contact to the base. The contact, base and the bent intermediate connecting portions are all formed from a generally flat sheet of conductive material. A blank for the surface mounted connector, as well as a rolled strip of connectors is disclosed.
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Janos Legrady from Putnam Valley, NY, age ~61 Get Report