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Jean-Marc Delbecq

from Santa Clara, CA
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Related to:
Andre L Delbecq, 87Jean-Luc Delbecq, 29Mireille Adrienne Delbecq, 35Mili M Delbecq, 89Lisabeth K Delbecq, 62Jeanluc Laurent Delbecq
Connected to:
Karel C Delbecq, 59Brandon L Delbel, 39Gian D Delbello, 52Lee L Delbello, 87Arlene S Delbene, 63Diane M Delbene, 66Penelope A Delbene, 53Mckinley Delbert, 69Susan M Delbert, 73Deanna J Delbiaggio, 54

Jean-Marc Delbecq Phones & Addresses

  • 868 College Ave, Santa Clara, CA 95050 (408) 421-5824

Work

Company: Verifone 1996 Position: Senior director, development, integrated systems

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Jean-Marc Delbecq Photo 1

Director Of Development

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Location:
Santa Clara, CA
Industry:
Electrical/Electronic Manufacturing
Work:
Verifone
Senior Director, Development, Integrated Systems
Verifone
Director of Development

Publications

Us Patents

Payment System With Outdoor Terminal

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US Patent:
20070257109, Nov 8, 2007
Filed:
May 2, 2007
Appl. No.:
11/743523
Inventors:
William Johansen - Auburn CA, US
Jean-Marc Delbecq - Santa Clara CA, US
Daniel Ross - Los Altos CA, US
International Classification:
G06K 5/00
G06K 15/00
G07F 19/00
US Classification:
235383000, 235379000, 235380000
Abstract:
A point of sale system is provided that can selectively control operation of one or more peripherals. The system includes a payment terminal with a reader for an electronic payment card and a port for communication with the peripheral. The system further includes a peripheral with a reader for the electronic payment card, and a monitor with a first port for coupling to the payment terminal and a second port for coupling to the payment device. The monitor includes a microcontroller providing for communication between the payment terminal and the peripheral, and the monitor determines an operational status of the peripheral. The monitor causes a redirection of communication as necessary based on the operational status of the peripheral.

Method Of Producing A Radio Frequency Transponder With A Molded Environmentally Sealed Package

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US Patent:
54207576, May 30, 1995
Filed:
Jun 11, 1993
Appl. No.:
8/158922
Inventors:
Noel H. Eberhardt - Cupertino CA
Jean-Marc Delbecq - Santa Clara CA
Assignee:
Indala Corporation - San Jose CA
International Classification:
H05K 102
US Classification:
361813
Abstract:
A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead type substrate frame, the components are encapsulated in a plastic housing in a plastic molding process so that the housing is supported in the frame only by a plurality of the leads, and then severing the leads at the periphery of the housing to provide a leadless package. The frame may be formed of a conductive material, an insulating material or as a printed circuit board. A novel printed circuit type lead frame whereby a coil of the circuit may be mechanically attached and directly secured to the frame is additionally disclosed.
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Jean-Marc Delbecq from Santa Clara, CA Get Report