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Jeffrey Allen Zitz

from Poughkeepsie, NY
Age ~60
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Also known as:
Jeffrey A Zitz, Jeff A Zitz, Jeffery A Zitz
Phone and address:
10 W Marshall Dr, Poughkeepsie, NY 12601
(845) 471-7157
Related to:
Holly R Denning, 31Gregory P Zitz, 72Joanne Zitz, 54Ann M Demarco, 55Anna T Kammerer, 81Frank J Zitz, 95Joseph J Kammerer, 91
Connected to:
Elsie C Zitz, 103Jason E Zitzelberger, 50Amy L Zitzelman, 48Bradley Zitzer, 34Frederick K Zitzer, 83Eric W Zitzewitz, 52Eric J Zitzka, 44Judy L Zitzka, 58Rachel E Zitzke, 34Frank F Zitzman, 59

Jeffrey Zitz Phones & Addresses

  • 10 W Marshall Dr, Poughkeepsie, NY 12601 (845) 471-7157
  • 28 Marshall St, Poughkeepsie, NY 12601 (845) 471-7157
  • 28 Marshall Dr, Poughkeepsie, NY 12601 (845) 471-7157
  • 74 Edgewood Dr #R, Poughkeepsie, NY 12603 (914) 471-7157
  • Rhinebeck, NY
  • 28 W Marshall Dr, Poughkeepsie, NY 12601

Work

Company: Ibm Dec 1987 Position: Senior technical staff member

Education

Degree: Masters School / High School: Rensselaer Polytechnic Institute 1982 to 1990 Specialities: Mechanical Engineering

Skills

Electronics Packaging • Finite Element Analysis • Mechanical Product Design • Statistical Data Analysis • Virtual Qualification Methods • Risk Analysis • Project Management • Technical Leadership • Asic • Cmos • Engineering Management • Strategy • Design of Experiments • Manufacturing • Simulations

Interests

Beekeeper • Gardener • Children • Winemaker • Antique Car Restorer • Father and Husband

Emails

j***[email protected]

Industries

Computer Hardware

Resumes

Resumes

Jeffrey Zitz Photo 1

Senior Technical Staff Member

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Location:
74 Edgewood Dr, Poughkeepsie, NY 12603
Industry:
Computer Hardware
Work:
Ibm
Senior Technical Staff Member
Data General Jun 1986 - Dec 1987
Hardware Engineer
Education:
Rensselaer Polytechnic Institute 1982 - 1990
Masters, Mechanical Engineering
Skills:
Electronics Packaging
Finite Element Analysis
Mechanical Product Design
Statistical Data Analysis
Virtual Qualification Methods
Risk Analysis
Project Management
Technical Leadership
Asic
Cmos
Engineering Management
Strategy
Design of Experiments
Manufacturing
Simulations
Interests:
Beekeeper
Gardener
Children
Winemaker
Antique Car Restorer
Father and Husband

Publications

Us Patents

Method For Direct Attachment Of A Chip To A Cooling Member

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US Patent:
6413353, Jul 2, 2002
Filed:
Feb 1, 1999
Appl. No.:
09/241238
Inventors:
Frank Louis Pompeo - Montgomery NY
Alain A. Caron - Quebec, CA
Jeffrey Thomas Coffin - Pleasant Valley NY
Jeffrey Allen Zitz - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B32B 3126
US Classification:
1563073, 438119
Abstract:
A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.

High Density Thermal Solution For Direct Attach Modules

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US Patent:
6657864, Dec 2, 2003
Filed:
Dec 16, 2002
Appl. No.:
10/320845
Inventors:
Warren D. Dyckman - Peekskill NY
Edward R. Pillai - Wappingers Falls NY
Jeffrey A. Zitz - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361704, 361718, 361719, 361708, 257706, 165 802, 165 803
Abstract:
A high power density thermal packaging solution. A highly efficient thermal path is provided using a lid of a unique design configuration that connects the chip back-side to both a heat sink and thermally conductive substrate vias thus establishing two thermal paths to carry heat from the die. The thermal interface between the chip back-side to lid and lid-to-substrate is enhanced with a thermally conductive elastomer. The heat is conducted through the substrate through thermal vias that are added to the perimeter of the substrate or which may be configured from preexisting electrical shielding structures that connect the top surface of the substrate to the bottom of the package. The bottom surface connection then conducts the heat to a copper ground plane in the printed circuit card. The heat from the die to the heat sink is transferred in the conventional method using the thin layer of thermally conductive elastomer to complete the thermal path from chip to lid to heat sink.

Stress Resistant Land Grid Array (Lga) Module And Method Of Forming The Same

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US Patent:
6703560, Mar 9, 2004
Filed:
Apr 19, 2001
Appl. No.:
09/838454
Inventors:
Patrick Anthony Coico - Fishkill NY
James H. Covell - Poughkeepsie NY
Benjamin V. Fasano - New Windsor NY
Lewis S. Goldman - Bedford NY
Ronald L. Hering - Pleasant Valley NY
Sundar M. Kamath - San Jose CA
Kenneth Charles Marston - Wappingers Falls NY
Frank Louis Pompeo - Redding CT
Karl J. Puttlitz - Wappingers Falls NY
Jeffrey Allen Zitz - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2302
US Classification:
174 524, 257704
Abstract:
An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

Emi Shielding For Semiconductor Chip Carriers

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US Patent:
6740959, May 25, 2004
Filed:
Aug 1, 2001
Appl. No.:
09/921062
Inventors:
David James Alcoe - Vestal NY
Jeffrey Thomas Coffin - Pleasant Valley NY
Michael Anthony Gaynes - Vestal NY
Harvey Charles Hamel - Poughkeepsie NY
Mario J. Interrante - New Paltz NY
Brenda Lee Peterson - Wappingers Falls NY
Megan J. Shannon - Wappingers Falls NY
William Edward Sablinski - Beacon NY
Christopher Todd Spring - Wappingers Falls NY
Randall Joseph Stutzman - Vestal NY
Renee L. Weisman - Poughkeepsie NY
Jeffrey Allen Zitz - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23552
US Classification:
257659, 257660, 257661, 257662
Abstract:
Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Chip Cooling

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US Patent:
6774482, Aug 10, 2004
Filed:
Dec 27, 2002
Appl. No.:
10/330742
Inventors:
Evan George Colgan - Chestnut Ridge NY
John Harold Magerlein - Yorktown Heights NY
Robert Luke Wisnieff - Ridgefield CT
Jeffrey Allen Zitz - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2334
US Classification:
257712, 257700, 257707, 257713, 257720, 257730
Abstract:
In an integrated circuit structure, such as in an MCM or in an SCM, a particulate thermally conductive conformable material, such as a thermal paste, is applied between a heat-generating chip and a cooling plate. Modification of the microstructure of at least one of the two nominally parallel surfaces which are in contact with the material is provided in a discrete pattern of sloped recesses. The largest particles in the material preferentially migrate downward into the recesses. The average thickness of the conductive paste is reduced to below the diameter of the largest particles dispersed in the material, providing improved cooling.

Method And Apparatus To Form A Reworkable Seal On An Electronic Module

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US Patent:
6955543, Oct 18, 2005
Filed:
Aug 11, 2003
Appl. No.:
10/604695
Inventors:
Gaetano P. Messina - Hopewell Junction NY, US
Patrick A. Coico - Fishkill NY, US
Lewis S. Goldmann - Bedford NY, US
Richard F. Indyk - Wappingers Falls NY, US
Vladimir Jambrih - Kingston NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R012/00
US Classification:
439 73, 257712, 361704, 439526
Abstract:
A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.

Stress Resistant Land Grid Array (Lga) Module And Method Of Forming The Same

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US Patent:
6964885, Nov 15, 2005
Filed:
Jan 6, 2004
Appl. No.:
10/752255
Inventors:
Patrick Anthony Coico - Fishkill NY, US
James H. Covell - Poughkeepsie NY, US
Benjamin V. Fasano - New Windsor NY, US
Lewis S. Goldman - Bedford NY, US
Ronald L. Hering - Pleasant Valley NY, US
Sundar Kamath - San Jose CA, US
Kenneth Charles Marston - Wappingers Falls NY, US
Frank Louis Pompeo - Redding CT, US
Karl J. Puttlitz - Wappingers Falls NY, US
Jeffrey Allen Zitz - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L021/44
H01L021/48
H01L021/50
US Classification:
438122, 438121, 438106, 257712, 257720
Abstract:
An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

Chip Package Having Chip Extension And Method

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US Patent:
7250576, Jul 31, 2007
Filed:
May 19, 2005
Appl. No.:
10/908615
Inventors:
Evan G. Colgan - Chestnut Ridge NY, US
David L. Edwards - Poughkeepsie NY, US
Benjamin V. Fasano - New Windsor NY, US
Kamal K. Sikka - Poughkeepsie NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Wei Zou - Wappingers Falls NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 1/16
US Classification:
174260, 174252, 257707
Abstract:
A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.
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Jeffrey Allen Zitz from Poughkeepsie, NY, age ~60 Get Report