Inventors:
Lei Zhong - Parker TX, US
John Fretwell - Fort Worth TX, US
Kara Lee Sherman - Santa Clara CA, US
Robert William Fiordalice - Los Altos Hills CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01R 31/305
Abstract:
One embodiment relates to a method for detecting defects in circuitry formed on a semiconductor substrate. A first scan of said circuitry is performed by scanning a primary electron beam in a first scan direction relative to said circuitry, and secondary electrons emitted during the first scan are detected so as to form a first voltage-contrast image. A second scan of said circuitry is performed by scanning the primary electron beam in a second scan direction relative to said circuitry, and secondary electrons emitted during the second scan are detected so as to form a second voltage-contrast image. The second scan direction is non-parallel to the first scan direction. The first and second voltage-contrast images are then compared to detect electrically-active defects. Other embodiments, aspects and features are also disclosed.
