Search

John Olenick Phones & Addresses

  • 202 Portside, Buffalo, NY 14202 (716) 852-8378
  • West Seneca, NY
  • Allentown, PA
  • 353 Campbell Rd, Brockport, NY 14420
  • 363 Campbell Rd, Brockport, NY 14420
  • Thompson, CT
  • Columbia, MD
  • Dayville, CT

Professional Records

License Records

John R. Olenick

License #:
T1-0004899 - Expired
Category:
Electrical Examiners
Type:
Master Electrician

Resumes

Resumes

John Olenick Photo 1

Ceramic Materials Consultant

View page
Location:
Buffalo, NY
Industry:
Glass, Ceramics, & Concrete
Work:
Milcomm Ceramics
Ceramic Materials Consultant

Ep Barrier Coating Apr 2008 - Feb 2009
President

Enrg Apr 2008 - Feb 2009
Owner, President and Chief Executive Officer

Tyco Intl M/A-Com Mar 2000 - Dec 2002
Director, Fuel Cell Programs

Eastman Kodak 1994 - 2000
Operations Manager
Education:
State University of New York College at Buffalo 2004 - 2005
University at Buffalo School of Management, the State University of New York 2003 - 2004
Associates, Associate of Arts, Entrepreneurship
University of Connecticut 1990 - 1992
The Johns Hopkins University - Carey Business School 1979 - 1980
Master of Business Administration, Masters
Penn State University 1974 - 1978
Bachelors, Bachelor of Science, Engineering
Skills:
Entrepreneurship
Business Planning
Strategic Planning
Program Management
Product Development
New Business Development
Engineering
Materials
Manufacturing
Operations Management
Electronics
Business Strategy
Process Improvement
Fuel Cells
Start Ups
Process Engineering
Team Building
Materials Science
Strategy
Coatings
Six Sigma
Business Development
Commercialization
Analysis
Technology Transfer
Ceramic Processing
Problem Solving
Strategy Development
R
Languages:
French
German
John Olenick Photo 2

Owner

View page
Location:
Buffalo, NY
Industry:
Glass, Ceramics, & Concrete
Work:
Enrg
Owner
Education:
Penn State Great Valley 1974 - 1978
John Olenick Photo 3

John Olenick

View page
John Olenick Photo 4

John Olenick

View page

Business Records

Name / Title
Company / Classification
Phones & Addresses
John Olenick
Owner, President
ENrG Incorporated
Glass, Ceramics & Concrete · Mfg Nonmetallic Mineral Products Mfg Semiconductors/Related Devices · Structural Engineer · Engineering Svcs
155 Rano St STE 300, Buffalo, NY 14207
(716) 873-2939, (716) 874-1880, (716) 873-3196
John A. Olenick
Insyte Consulting
Management Consulting · Management Consulting Services
726 Exchange St SUITE 812, Buffalo, NY 14210
(716) 636-3626
John Olenick
NATRION ENRG LLC
Whol Electrical Equipment
155 Rano St STE 300, Buffalo, NY 14207

Publications

Us Patents

Carrying Case For Personal Digital Assistant Device And Ancillary Electronic Device

View page
US Patent:
6501643, Dec 31, 2002
Filed:
Nov 17, 2000
Appl. No.:
09/716100
Inventors:
Barbara A. Sayers - Victor NY
John A. Olenick - Buffalo NY
Assignee:
Eastman Kodak Company - Rochester NY
International Classification:
G06F 116
US Classification:
361683, 206576, 206578
Abstract:
A carrying case (either a soft case or a hard case) is taught that includes a section or compartment for receiving a personal digital assistant device that allows for access to the controls in view of the display without removing the device from the carrying case when the case is opened. Additionally, the carrying case is provided with a second compartment independent of the section or compartment for receiving the personal digital assistant device. The second compartment is adapted to receive an ancillary device such that when a user desires to use the ancillary device, the user removes the ancillary device from its compartment and also removes the personal digital assistant from its compartment and interconnects the two to allow for operation of the ancillary device. However, when the user desires to use the personal digital assistant alone, it is only necessary to open the carrying case and operate the personal digital assistant without having to remove it from the carrying case. Means are therefore provided for retaining the personal digital assistant in the carrying case when the carrying case is opened.

In-Situ Seal Integrity Monitoring

View page
US Patent:
7281412, Oct 16, 2007
Filed:
Sep 8, 2005
Appl. No.:
11/222507
Inventors:
John A. Olenick - Buffalo NY, US
Timothy J. Curry - Buffalo NY, US
Robert A. Bourdelaise - Gambrills MD, US
Eli A. Richards - Catonsville MD, US
Paul A. Vichot - Eldersburg MD, US
Barry E. Grabow - Laurel MD, US
Samuel F. Wilderson - Simpsonville MD, US
International Classification:
G01M 3/00
US Classification:
73 52, 73866
Abstract:
A high-temperature seal having in-situ integrity monitoring capability includes a quantity of dielectric material sealing an interface between adjacent structures and an electrical transmission line embedded within the dielectric material. A signal injection port is provided for exciting the transmission line with an excitation signal. One or more sample ports are provided for sampling the transmission line to obtain signal samples resulting from the excitation signal. The sample port(s) are adapted for connection to a signal analyzer adapted to analyze the signal samples for indications of seal integrity problems. Using a technique such as time domain reflectometry or frequency response analysis, the transmission line can be monitored for changes in characteristic impedance due to changes in seal dielectric constant and/or disruption of the transmission line. Such evaluation provides useful information for making determinations about seal integrity in a manner that permits safe seal operation and minimization of resultant stress modes.

Method Of Manufacture Multichip Module Substrate

View page
US Patent:
52876195, Feb 22, 1994
Filed:
Mar 9, 1992
Appl. No.:
7/847895
Inventors:
W. David Smith - Abington CT
John A. Olenick - Thompson CT
Carlos L. Barton - Brooklyn CT
Jane L. Cercena - Ashford CT
Daniel J. Navarro - Putnam CT
Kathleen R. Olenick - Thompson CT
Angela M. Kneeland - Putnam CT
Thomas S. Kneeland - Putnam CT
Mark F. Sylvester - Pawtucket RI
Curtis H. Kempton - Mesa AZ
Scott E. Derosier - Rogers CT
Lynn E. Burdick - Hampton CT
Richard T. Traskos - Brooklyn CT
Robert B. Huntington - Tempe AZ
James S. Rivers - Ballouville CT
Samuel Gazit - West Hartford CT
Jeffrey B. Ott - Brooklyn CT
William P. Harper - Tempe AZ
Assignee:
Rogers Corporation - Rogers CT
International Classification:
H01K 310
US Classification:
29852
Abstract:
In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management.

Method Of Manufacturing A Multilayer Circuit Board

View page
US Patent:
53296958, Jul 19, 1994
Filed:
Dec 31, 1992
Appl. No.:
7/999494
Inventors:
Richard T. Traskos - Brooklyn CT
John A. Olenick - Brockport NY
Assignee:
Rogers Corporation - Rogers CT
International Classification:
H05K 336
US Classification:
29830
Abstract:
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding such as a fluoropolymeric based substrate having vias therethrough and a circuit comprised of a layer of suitable conductive material. A fusible conductive bonding material (e. g. , solder) or a noble metal is applied wherever electrical connections are desired. At least one other of the circuit layers comprises a cofired multilayer ceramic circuit having vias and circuits comprised of a layer of suitable conductive material with a fusible conductive bonding material (e. g. , solder) or a noble metal applied wherever electrical connections are desired. Once stacked the circuits are subjected to lamination under heat and pressure to adhere each polymeric substrate to an adjacent ceramic substrate and to diffuse the noble metal or fuse the solder layers together to form an integral multilayer circuit having solid conductive interconnects.

Method Of Manufacturing A Multilayer Circuit Board

View page
US Patent:
52749126, Jan 4, 1994
Filed:
Sep 1, 1992
Appl. No.:
7/939105
Inventors:
John A. Olenick - Brockport NY
Robert C. Daigle - Sterling CT
Assignee:
Rogers Corporation - Rogers CT
International Classification:
H05K 336
US Classification:
29830
Abstract:
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. The circuits each include a layer of a noble metal at, at least, selected exposed locations. Once stacked the circuits are subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and diffuse conductive layers together to form an integral multilayer circuit having solid conductive interconnects.

Method Of Manufacturing A Multilayer Circuit

View page
US Patent:
54408059, Aug 15, 1995
Filed:
Sep 27, 1993
Appl. No.:
8/127975
Inventors:
Robert C. Daigle - Sterling CT
W. David Smith - Abington CT
John A. Olenick - Brockport NY
David J. Arthur - Norwood MA
Gwo S. Swei - Northboro MA
Assignee:
Rogers Corporation - Rogers CT
International Classification:
H05K 336
US Classification:
29830
Abstract:
In accordance with the present invention, a circuit assembly is manufactured in an additive process using at least one layer of a fluoropolymer composite material and a conductive material. The conductive layers are plated, and the fluoropolymer composite layers are laminated. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. A plurality of these circuit assemblies are stacked, one on top of the other. At least, selected exposed locations of the conductive material comprise a diffusible conductive material (e. g. , gold). Once stacked the circuit assemblies are subjected to lamination under heat and pressure to simultaneously fuse adjacent fluoropolymer composite material and diffuse adjacent diffusible conductive material together to form an integral multilayer circuit having solid conductive interconnects.

Method Of Manufacturing Ceramic Tape

View page
US Patent:
20210402646, Dec 30, 2021
Filed:
Sep 8, 2021
Appl. No.:
17/468752
Inventors:
- CORNING NY, US
William Joseph Bouton - Big Flats NY, US
Jacqueline Leslie Brown - Lindley NY, US
Timothy Joseph Curry - Orchard Park NY, US
Roman E. Hurny - West Seneca NY, US
Lanrik Wayne Kester - Savona NY, US
Thomas Dale Ketcham - Horseheads NY, US
John Albert Olenick - Buffalo NY, US
Kathleen Ritter Olenick - Buffalo NY, US
Jeremy Paananen - Middleport NY, US
Thomas Silverblatt - Amherst NY, US
Dell Joseph St Julien - Watkins Glen NY, US
Viswanathan Venkateswaran - Williamsville NY, US
Nathan Michael Zink - Painted Post NY, US
International Classification:
B28B 11/24
C04B 35/443
C04B 35/115
C04B 35/486
C04B 35/64
Abstract:
A method of manufacturing ceramic tape includes a step of directing a tape of partially-sintered ceramic into a furnace. The tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic. The method further includes steps of conveying the tape through the furnace and further sintering the tape as the tape is conveyed through the furnace. The porosity of the tape decreases during the further sintering step.

Polycrystalline Waveguide

View page
US Patent:
20210162626, Jun 3, 2021
Filed:
Feb 11, 2021
Appl. No.:
17/173637
Inventors:
- Corning NY, US
William Joseph Bouton - Big Flats NY, US
Jacqueline Leslie Brown - Lindley NY, US
Timothy Joseph Curry - Orchard Park NY, US
Roman E. Hurny - West Seneca NY, US
Lanrik Wayne Kester - Savona NY, US
Thomas Dale Ketcham - Horseheads NY, US
John Albert Olenick - Buffalo NY, US
Kathleen Ritter Olenick - Buffalo NY, US
Jeremy Paananen - Middleport NY, US
Thomas Silverblatt - Amherst NY, US
Dell Joseph St Julien - Watkins Glen NY, US
Viswanathan Venkateswaran - Williamsville NY, US
Nathan Michael Zink - Painted Post NY, US
International Classification:
B28B 11/24
C04B 35/443
C04B 35/115
C04B 35/486
C04B 35/64
Abstract:
A waveguide includes a body of material having a width, a thickness, and a length, where the width is orthogonal to the thickness, and the length is orthogonal to the thickness and the width. The material includes polycrystalline ceramic that is transmissive such that the body is configured as a waveguide. The thickness is no more than 5 millimeters and at least 20 nanometers, the width is greater than or equal to the thickness, and the length is at least 100 times greater than the width. The body of material has a granular profile such that grains of the material protrude generally outward from a surface of the body with a height of at least 25 nanometers and no more than 100 micrometers relative to recessed portions of the surface of the body at boundaries between the grains.
John A Olenick from Buffalo, NY, age ~68 Get Report