John A Olenick

6501643, Dec 31, 2002

Nov 17, 2000

09/716100

Barbara A. Sayers - Victor NY
John A. Olenick - Buffalo NY

Eastman Kodak Company - Rochester NY

G06F 116

361683, 206576, 206578

A carrying case (either a soft case or a hard case) is taught that includes a section or compartment for receiving a personal digital assistant device that allows for access to the controls in view of the display without removing the device from the carrying case when the case is opened. Additionally, the carrying case is provided with a second compartment independent of the section or compartment for receiving the personal digital assistant device. The second compartment is adapted to receive an ancillary device such that when a user desires to use the ancillary device, the user removes the ancillary device from its compartment and also removes the personal digital assistant from its compartment and interconnects the two to allow for operation of the ancillary device. However, when the user desires to use the personal digital assistant alone, it is only necessary to open the carrying case and operate the personal digital assistant without having to remove it from the carrying case. Means are therefore provided for retaining the personal digital assistant in the carrying case when the carrying case is opened.

7281412, Oct 16, 2007

Sep 8, 2005

11/222507

John A. Olenick - Buffalo NY, US
Timothy J. Curry - Buffalo NY, US
Robert A. Bourdelaise - Gambrills MD, US
Eli A. Richards - Catonsville MD, US
Paul A. Vichot - Eldersburg MD, US
Barry E. Grabow - Laurel MD, US
Samuel F. Wilderson - Simpsonville MD, US

G01M 3/00

73 52, 73866

A high-temperature seal having in-situ integrity monitoring capability includes a quantity of dielectric material sealing an interface between adjacent structures and an electrical transmission line embedded within the dielectric material. A signal injection port is provided for exciting the transmission line with an excitation signal. One or more sample ports are provided for sampling the transmission line to obtain signal samples resulting from the excitation signal. The sample port(s) are adapted for connection to a signal analyzer adapted to analyze the signal samples for indications of seal integrity problems. Using a technique such as time domain reflectometry or frequency response analysis, the transmission line can be monitored for changes in characteristic impedance due to changes in seal dielectric constant and/or disruption of the transmission line. Such evaluation provides useful information for making determinations about seal integrity in a manner that permits safe seal operation and minimization of resultant stress modes.

52876195, Feb 22, 1994

Mar 9, 1992

7/847895

W. David Smith - Abington CT
John A. Olenick - Thompson CT
Carlos L. Barton - Brooklyn CT
Jane L. Cercena - Ashford CT
Daniel J. Navarro - Putnam CT
Kathleen R. Olenick - Thompson CT
Angela M. Kneeland - Putnam CT
Thomas S. Kneeland - Putnam CT
Mark F. Sylvester - Pawtucket RI
Curtis H. Kempton - Mesa AZ
Scott E. Derosier - Rogers CT
Lynn E. Burdick - Hampton CT
Richard T. Traskos - Brooklyn CT
Robert B. Huntington - Tempe AZ
James S. Rivers - Ballouville CT
Samuel Gazit - West Hartford CT
Jeffrey B. Ott - Brooklyn CT
William P. Harper - Tempe AZ

Rogers Corporation - Rogers CT

H01K 310

29852

In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management.

53296958, Jul 19, 1994

Dec 31, 1992

7/999494

Richard T. Traskos - Brooklyn CT
John A. Olenick - Brockport NY

Rogers Corporation - Rogers CT

H05K 336

29830

Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding such as a fluoropolymeric based substrate having vias therethrough and a circuit comprised of a layer of suitable conductive material. A fusible conductive bonding material (e. g. , solder) or a noble metal is applied wherever electrical connections are desired. At least one other of the circuit layers comprises a cofired multilayer ceramic circuit having vias and circuits comprised of a layer of suitable conductive material with a fusible conductive bonding material (e. g. , solder) or a noble metal applied wherever electrical connections are desired. Once stacked the circuits are subjected to lamination under heat and pressure to adhere each polymeric substrate to an adjacent ceramic substrate and to diffuse the noble metal or fuse the solder layers together to form an integral multilayer circuit having solid conductive interconnects.

52749126, Jan 4, 1994

Sep 1, 1992

7/939105

John A. Olenick - Brockport NY
Robert C. Daigle - Sterling CT

Rogers Corporation - Rogers CT

H05K 336

29830

Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. The circuits each include a layer of a noble metal at, at least, selected exposed locations. Once stacked the circuits are subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and diffuse conductive layers together to form an integral multilayer circuit having solid conductive interconnects.

54408059, Aug 15, 1995

Sep 27, 1993

8/127975

Robert C. Daigle - Sterling CT
W. David Smith - Abington CT
John A. Olenick - Brockport NY
David J. Arthur - Norwood MA
Gwo S. Swei - Northboro MA

Rogers Corporation - Rogers CT

H05K 336

29830

In accordance with the present invention, a circuit assembly is manufactured in an additive process using at least one layer of a fluoropolymer composite material and a conductive material. The conductive layers are plated, and the fluoropolymer composite layers are laminated. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. A plurality of these circuit assemblies are stacked, one on top of the other. At least, selected exposed locations of the conductive material comprise a diffusible conductive material (e. g. , gold). Once stacked the circuit assemblies are subjected to lamination under heat and pressure to simultaneously fuse adjacent fluoropolymer composite material and diffuse adjacent diffusible conductive material together to form an integral multilayer circuit having solid conductive interconnects.

20210402646, Dec 30, 2021

Sep 8, 2021

17/468752

- CORNING NY, US
William Joseph Bouton - Big Flats NY, US
Jacqueline Leslie Brown - Lindley NY, US
Timothy Joseph Curry - Orchard Park NY, US
Roman E. Hurny - West Seneca NY, US
Lanrik Wayne Kester - Savona NY, US
Thomas Dale Ketcham - Horseheads NY, US
John Albert Olenick - Buffalo NY, US
Kathleen Ritter Olenick - Buffalo NY, US
Jeremy Paananen - Middleport NY, US
Thomas Silverblatt - Amherst NY, US
Dell Joseph St Julien - Watkins Glen NY, US
Viswanathan Venkateswaran - Williamsville NY, US
Nathan Michael Zink - Painted Post NY, US

B28B 11/24
C04B 35/443
C04B 35/115
C04B 35/486
C04B 35/64

A method of manufacturing ceramic tape includes a step of directing a tape of partially-sintered ceramic into a furnace. The tape is partially-sintered such that grains of the ceramic are fused to one another yet the tape still includes at least 10% porosity by volume, where the porosity refers to volume of the tape unoccupied by the ceramic. The method further includes steps of conveying the tape through the furnace and further sintering the tape as the tape is conveyed through the furnace. The porosity of the tape decreases during the further sintering step.

20210162626, Jun 3, 2021

Feb 11, 2021

17/173637

- Corning NY, US
William Joseph Bouton - Big Flats NY, US
Jacqueline Leslie Brown - Lindley NY, US
Timothy Joseph Curry - Orchard Park NY, US
Roman E. Hurny - West Seneca NY, US
Lanrik Wayne Kester - Savona NY, US
Thomas Dale Ketcham - Horseheads NY, US
John Albert Olenick - Buffalo NY, US
Kathleen Ritter Olenick - Buffalo NY, US
Jeremy Paananen - Middleport NY, US
Thomas Silverblatt - Amherst NY, US
Dell Joseph St Julien - Watkins Glen NY, US
Viswanathan Venkateswaran - Williamsville NY, US
Nathan Michael Zink - Painted Post NY, US

B28B 11/24
C04B 35/443
C04B 35/115
C04B 35/486
C04B 35/64

A waveguide includes a body of material having a width, a thickness, and a length, where the width is orthogonal to the thickness, and the length is orthogonal to the thickness and the width. The material includes polycrystalline ceramic that is transmissive such that the body is configured as a waveguide. The thickness is no more than 5 millimeters and at least 20 nanometers, the width is greater than or equal to the thickness, and the length is at least 100 times greater than the width. The body of material has a granular profile such that grains of the material protrude generally outward from a surface of the body with a height of at least 25 nanometers and no more than 100 micrometers relative to recessed portions of the surface of the body at boundaries between the grains.