John Surowka

6387830, May 14, 2002

Mar 10, 1999

09/265210

Lawrence Robert Blumberg - Johnson City NY
Robert Maynard Japp - Vestal NY
William John Rudik - Vestal NY
John Frank Surowka - Binghamton NY

International Business Machines Corporation - Armonk NY

B32B 526

442103, 29832, 442180, 442247, 442251, 442255

A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0. 05% to 0. 3%, preferably from about 0. 08% to 0. 10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably not B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat. Optionally, the reduced CTE laminate is sandwiched between two layers of metal, preferably copper.

6586352, Jul 1, 2003

Oct 20, 2000

09/693766

Lawrence Robert Blumberg - Johnson City NY
Robert Maynard Japp - Vestal NY
William John Rudik - Vestal NY
John Frank Surowka - Binghamton NY

International Business Machines Corporation - Armonk NY

B32B 2709

442181, 442103, 442247, 442255, 29832

A simple, inexpensive, drillable, reduced CTE laminate and circuitized structure comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0. 05% to 0. 3%, preferably from about 0. 08% to 0. 10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat. The method further comprises providing a resin volume percent, woven glass cloth volume percent and metal volume percent of the circuitized structure to be fabricated; selecting a desired CTE for the circuitized structure to be fabricated; and determining the amount of non-woven quartz or non-woven glass mat to be incorporated according to a formula.

6841026, Jan 11, 2005

Mar 26, 2002

10/107112

Lawrence Robert Blumberg - Johnson City NY, US
Robert Maynard Japp - Vestal NY, US
William John Rudik - Vestal NY, US
John Frank Surowka - Binghamton NY, US

International Business Machines Corporation - Armonk NY

B32B 3104

156285, 156166, 442103, 442180, 442247, 442251, 442255, 442252, 442253, 442262

A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. One embodiment of the reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0. 05% to 0. 3%, preferably from about 0. 08% to 0. 10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat.

61367338, Oct 24, 2000

Jun 13, 1997

8/874902

Lawrence Robert Blumberg - Johnson City NY
Robert Maynard Japp - Vestal NY
William John Rudik - Vestal NY
John Frank Surowka - Binghamton NY

International Business Machines Corporation - Armonk NY

B32B 526
C09J 502

442247

A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0. 05% to 0. 3%, preferably from about 0. 08% to 0. 10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat. Optionally, the reduced CTE laminate is sandwiched between two layers of metal, preferably copper.

61769851, Jan 23, 2001

Oct 23, 1998

9/178084

Francis J. Downes - Vestal NY
Raymond Thomas Galasco - Vestal NY
Robert Maynard Japp - Vestal NY
John Frank Surowka - Binghamton NY

International Business Machines Corporation - Armonk NY

C25D 1704

2042971

An electroplating apparatus provides high current electrical connections in a small area to a workpiece. The contact area may use a dendrite surface to improve the connection. An insulative gasket prevents electroplating fluids from entering the region about the contact area. A heavy core laminated within a supporting structure provides uniform current distribution of high electrical currents to the dendrite covered contact areas.