Inventors:
Harry R. Bickford - Ossining NY
Raymond R. Horton - Dover Plains NY
Ismail C. Noyan - Peekskill NY
Michael J. Palmer - Walden NY
John C. Zyzo - Waterbury CT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23K 112
Abstract:
Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.