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Joseph B Brief

from Merritt Island, FL
Age ~57
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Also known as:
Joseph Benjamin Brief, Joseph C Brief, Joe B Brief
Phone and address:
816 Brookstone Dr, Merritt Island, FL 32952
(321) 338-2123
Related to:
Elaine Brief, 83Brief Seymour, 92Varda Brief
Connected to:
Ira J Brief, 73Richard A Briefman, 66Steven A Briefs, 70David Briegel, 53Jonathan M Briegel, 34Laura A Briegel, 57Tyler F Briegel, 31Marty R Brieger, 49Timothy D Brieger, 51Ylse F Brieger, 118

Joseph Brief Phones & Addresses

  • 816 Brookstone Dr, Merritt Is, FL 32952 (321) 338-2123
  • Merritt Island, FL
  • 488 Sheridan Ave, Satellite Bch, FL 32937 (321) 543-9908
  • Melbourne, FL
  • North Miami Beach, FL
  • Chattanooga, TN
  • Satellite Bch, FL
  • 816 Brookstone Dr, Merritt Island, FL 32952 (321) 543-9908

Publications

Us Patents

Ruggedized Module For Securely Retaining Multi-Optical Fiber Interconnect Ferrules

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US Patent:
7090408, Aug 15, 2006
Filed:
Apr 1, 2004
Appl. No.:
10/816323
Inventors:
Joseph Benjamin Brief - Satellite Beach FL, US
Ying-Ming Lee - Melbourne FL, US
Robert Grayson Wells - Melbourne Beach FL, US
James William Carpenter - Indialantic FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
G02B 6/38
US Classification:
385 71, 385 72
Abstract:
A ruggedized, snap-together, module securely retains a pair of mutually abutting fiber optic interconnect MT ferrules, that have been joined together by a ferrule aligning pin clamp structure. The module includes a generally rectangular base member having a ferrule retention cavity that is configured to retain a pair of MT ferrules and an associated pin clamp assembly therefor. A cover is configured to engage the base in such a manner that the two MT ferrules are firmly held in their intended face-to-face abutting condition as captured between the base and the cover. A bias compression spring is captured between the cover and the base in a manner that facilitates removal of the cover when it is desired to open the module and gain access to the two MT ferrules.

Decoupling Capacitor Closely Coupled With Integrated Circuit

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US Patent:
7145233, Dec 5, 2006
Filed:
Oct 30, 2003
Appl. No.:
10/696918
Inventors:
Robert S. Vinson - Indialantic FL, US
Joseph B. Brief - West Melbourne FL, US
Donald J. Beck - Palm Bay FL, US
Gregory M. Jandzio - Melbourne FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01L 23/34
US Classification:
257724, 257777, 257686, 361734, 361735, 361763, 361764, 361783
Abstract:
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

Decoupling Capacitor Closely Coupled With Integrated Circuit

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US Patent:
7642131, Jan 5, 2010
Filed:
Nov 8, 2006
Appl. No.:
11/557564
Inventors:
Robert S. Vinson - Indialantic FL, US
Joseph B. Brief - West Melbourne FL, US
Donald J. Beck - Palm Bay FL, US
Gregory M. Jandzio - Melbourne FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01L 21/00
US Classification:
438109, 438FOR 368, 438381, 438110, 257686, 257777, 257724, 257783, 361763, 361764, 361782, 361734, 361738, 361811
Abstract:
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

Decoupling Capacitor Closely Coupled With Integrated Circuit

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US Patent:
7705450, Apr 27, 2010
Filed:
Nov 8, 2006
Appl. No.:
11/557543
Inventors:
Robert S. Vinson - Indialantic FL, US
Joseph B. Brief - West Melbourne FL, US
Donald J. Beck - Palm Bay FL, US
Gregory M. Jandzio - Melbourne FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01L 23/34
US Classification:
257724, 257686, 257783, 257784, 361782
Abstract:
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

Decoupling Capacitor Closely Coupled With Integrated Circuit

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US Patent:
20030021096, Jan 30, 2003
Filed:
Jul 26, 2001
Appl. No.:
09/915762
Inventors:
Robert Vinson - Indialantic FL, US
Joseph Brief - West Melbourne FL, US
Donald Beck - Palm Bay FL, US
Gregory Jandzio - Melbourne FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H05K007/02
H01L027/13
US Classification:
361/782000, 361/783000, 257/724000, 257/777000, 029/832000
Abstract:
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
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Joseph B Brief from Merritt Island, FL, age ~57 Get Report