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Jurgen Preuninger

from Brooklyn, NY
Age ~59
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Also known as:
Juergen Preuninger
Phone and address:
16 Ocean Pkwy, Brooklyn, NY 11218
Connected to:
Alvin W Preuss, 110Brittany B Preuss, 38Deanna M Preuss, 81Elizabeth Preuss, 34Eva M Preuss, 119Fabian Preuss, 49Greg R Preuss, 58Jade K Preuss, 43Jane W Preuss, 85Lynn E Preuss, 76

Jurgen Preuninger Phones & Addresses

  • 16 Ocean Pkwy, Brooklyn, NY 11218
  • 75 Fieldstone Blvd, Wappingers Falls, NY 12590 (845) 297-0968
  • Wappingers Fl, NY
  • 16 Ocean Pkwy APT E18, Brooklyn, NY 11218

Work

Position: Precision Production Occupations

Education

Degree: Bachelor's degree or higher

Publications

Us Patents

Apparatus For Patterning A Semiconductor Wafer

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US Patent:
6809800, Oct 26, 2004
Filed:
Apr 25, 2003
Appl. No.:
10/424039
Inventors:
Oliver Genz - Dresden, DE
Jurgen Preuninger - Wappingers Falls NY
Gerhard Kunkel - Radebeul, DE
Assignee:
Infineon Technologies AG - Munich
International Classification:
G03B 2752
US Classification:
355 55, 355 53
Abstract:
An apparatus ( ) for patterning the surface of a semiconductor wafer ( ). A stage ( ) is coupled to a motor ( ) that is adapted to move the stage ( ) and a semiconductor wafer ( ) in a horizontal direction at a first speed A. A mask ( ) is disposed above the semiconductor wafer ( ), the mask ( ) being coupled to a motor ( ) that is adapted to move the mask ( ) in a horizontal direction at a second speed B. The ratio of the first and second speeds is different than the magnification factor, which may be other than 1:1 if a lens ( ) is used. The mask ( ) and the wafer ( ) may be moved in the same horizontal direction simultaneously during the exposure process at different speeds B and A, respectively, to provide a magnification or demagnification of the mask ( ) pattern onto the wafer ( ) surface.

Apparatus And Method For Patterning A Semiconductor Wafer

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US Patent:
20020127501, Sep 12, 2002
Filed:
Mar 8, 2001
Appl. No.:
09/801413
Inventors:
Oliver Genz - Dresden, DE
Jurgen Preuninger - Wappingers Falls NY, US
Gerhard Kunkel - Radebeul, DE
International Classification:
G03F007/20
US Classification:
430/397000, 430/313000, 430/396000, 355/050000
Abstract:
A method and apparatus () for patterning the surface of a semiconductor wafer (). A stage () is coupled to a motor () that is adapted to move the stage () and a semiconductor wafer () in a horizontal direction at a first speed A. A mask () is disposed above the semiconductor wafer (), the mask () being coupled to a motor () that is adapted to move the mask () in a horizontal direction at a second speed B. The ratio of the first and second speeds is different than the magnification factor, which may be other than 1:1 if a lens () is used. The mask () and the wafer () may be moved in the same horizontal direction simultaneously during the exposure process at different speeds B and A, respectively, to provide a magnification or demagnification of the mask () pattern onto the wafer () surface.
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Jurgen Preuninger from Brooklyn, NY, age ~59 Get Report