Inventors:
Kenneth Arthur Zeber - Oakland Park FL
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2348
H01L 2352
Abstract:
An integrated circuit chip (100) includes an integrated circuit die (105) having first and second opposing surfaces (110, 115). A first integrated circuit (205) is formed on the first surface (110), and has a first plurality of terminals (200) coupled thereto for connection to first circuitry external to the integrated circuit chip (100), wherein the first plurality of terminals (200) is formed on the first surface (110). A second integrated circuit (300) is formed on the second surface (115), is electrically isolated from the first integrated circuit (205), and has a second plurality of terminals (305) coupled thereto for connection to second circuitry external to the integrated circuit chip (100). The second plurality of terminals (305) is formed on the first surface (110) and is coupled to the second integrated circuit (300) via plated holes formed through the integrated circuit die (105). The second plurality of terminals (300) is electrically isolated from the first plurality of terminals (200) and the first integrated circuit (205).