Michael J Shaw

58233164, Oct 20, 1998

Oct 4, 1995

8/538931

Michael F. Shaw - Sunrise FL
Anthony J. Suppelsa - Coral Springs FL
Richard W. Jones - Lauderhill FL

Motorola, Inc. - Schaumburg IL

B65G 4300

198341

A computer controlled assembly line (10) contains multiple work cells (40) for assembling a printed circuit board (PCB). Each work cell contains a conveyor (30) that can independently adjust its width, and the work cells are arranged to process the printed circuit board within the cell. The work cells are arranged so that they can pass the printed circuit board from the conveyor in one work cell to the conveyor in the next cell. The conveyors have two parallel rails (35, 36) situated so that the distance between the rails can be automatically adjusted to accommodate printed circuit boards of varying widths on the same assembly line at the same time. Each work cell independently adjusts the width of its conveyor (i. e. the distance between the rails) to accommodate the incoming printed circuit board. When the PCB is cleared out of the first cell, a second PCB waiting to enter the first cell is scanned (20), and the conveyor width of the first cell is re-adjusted to accommodate the different size of the first PCB.

57710040, Jun 23, 1998

Jun 6, 1997

8/870222

Anthony J. Suppelsa - Coral Springs FL
Michael F. Shaw - Sunrise FL
Anthony B. Suppelsa - Coral Springs FL

Motorola, Inc. - Schaumburg IL

G08B 1710

340632

A hazardous gas detection system is integrated into a wireless communication device such as a two-way radio. The radio has housing (102) with an opening (104) for receiving external air. A bellows-like device (114) has a first side (116) which is attached to an audio speaker diaphragm (112) by a rigid interconnect element (126). A fixed second side (118) of the bellows has first and second ports, 120 and 122. Vibrations from the speaker diaphragm are transferred to the bellows, causing the bellows to expand and contract. During bellows expansion, air is sucked into a first port (120) of the bellows. As the bellows contracts, the air is forced out through a second port (122) of the bellows and directed toward a gas sensor (132) mounted on an internal surface (106) of the radio housing. A warning mechanism in communication with the gas sensor provides forewarning of dangerously high gas concentration levels.

58087117, Sep 15, 1998

Aug 22, 1997

8/916212

Anthony J. Suppelsa - Coral Springs FL
Michael F. Shaw - Sunrise FL
Thomas J. Swirbel - Davie FL

Motorola, Inc. - Schaumburg IL

G02F 11347
G02F 11335

349 74

A liquid crystal display assembly (10) can function in either a transparent or reflective mode. The assembly consists of a reflective-type liquid crystal display cell (12) placed in front of an electrochromic panel (14). When a display driver (16) activates the electrochromic panel, it absorbs light. When the driver energizes segments (15) of the reflective-type liquid crystal display cell, they become reflective, providing a visual image to an observer. When the electrochromic panel is not activated by the driver, it is transparent or translucent, allowing the observer to see completely through the liquid crystal display assembly.

57099057, Jan 20, 1998

Jan 28, 1997

8/789252

Michael F. Shaw - Sunrise FL
Anthony J. Suppelsa - Coral Springs FL
Dale R. Adams - Margate FL

Motorola, Inc. - Schaumburg IL

B05D 132
B05C 1102
B05C 320

427 8

A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.

20180375543, Dec 27, 2018

Aug 30, 2018

16/117608

- San Jose CA, US
Sushil KUMAR - San Ramon CA, US
Shawn PARKER - Santa Clara CA, US
Jonathan L. Kennedy - Grass Valley CA, US
Christopher Saint - Colfax CA, US
Michael Shaw - Granite Bay CA, US
James Little - Sacramento CA, US
Jeff Illgner - Grass Valley CA, US

H04B 1/40
H04W 52/02
H03F 3/21
H01L 23/66
H01L 25/16
H01L 25/18
H03F 3/193
H04B 1/04
H04B 1/16
H01L 27/06

An e-band transceiver includes a transmitter circuit and a receiver circuit. The transmitter circuit includes a surface mounted technology (SMT) module on which is mounted a silicon-germanium (SiGe) bipolar plus CMOS (BiCMOS) converter, a gallium arsenide (GaAs) pseudomorphic high-electron-mobility transistor (pHEMT) output amplifier coupled to the SiGe BiCMOS converter, and a microstrip/waveguide interface coupled to the GaAs pHEMT output amplifer. The receiver circuit of the e-band transceiver includes a receiver-side SMT module on which is mounted a receiver-side SiGe BiCMOS converter, a GaAs pHEMT low noise amplifier coupled to the receiver-side SiGe BiCMOS converter, and a receiver-side microstrip/waveguide interface coupled to the receiver-side GaAs pHEMT low noise amplifier.

20160323008, Nov 3, 2016

May 2, 2016

15/144193

- San Jose CA, US
Sushil Kumar - San Ramon CA, US
Shawn Parker - Santa Clara CA, US
Jonathan L. Kennedy - Grass Valley CA, US
Christopher Saint - Colfax CA, US
Michael Shaw - Granite Bay CA, US
James Little - Sacramento CA, US
Jeff Illgner - Grass Valley CA, US

H04B 1/40
H01L 29/161
H01L 25/16
H01L 29/20
H04W 52/02
H01L 27/092
H01L 23/66
H04B 1/04
H04B 1/16
H03F 3/193
H01L 29/778
H01L 27/06

An e-band transceiver includes a transmitter circuit and a receiver circuit. The transmitter circuit includes a surface mounted technology (SMT) module on which is mounted a silicon-germanium (SiGe) bipolar plus CMOS (BiCMOS) converter, a gallium arsenide (GaAs) pseudomorphic high-electron-mobility transistor (pHEMT) output amplifier coupled to the SiGe BiCMOS converter, and a microstrip/waveguide interface coupled to the GaAs pHEMT output amplifer. The receiver circuit of the e-band transceiver includes a receiver-side SMT module on which is mounted a receiver-side SiGe BiCMOS converter, a GaAs pHEMT low noise amplifier coupled to the receiver-side SiGe BiCMOS converter, and a receiver-side microstrip/waveguide interface coupled to the receiver-side GaAs pHEMT low noise amplifier.