Naoki I Kanayama

55991599, Feb 4, 1997

Jun 6, 1995

8/470770

Kazuo Sugiura - Tokyo, JP
Yoshimitsu Hisajima - Tokyo, JP
Naoki Kanayama - San Jose CA

Kabushiki Kaisha Shinkawa - Tokyo
Shinkawa U.S.A., Inc. - Santa Clara CA

B66C 2300

4147443

A pellet conveying device used with a bonding machine for, for example, semiconductor devices, including a conveying arm that has a collet for holding pellets. The conveying arm can move vertically and pivot horizontally by two different driving sources so that the collet can be moved between predetermined two positions such as a pellet pick-up position and a pellet releasing position.

58189580, Oct 6, 1998

Nov 25, 1996

8/758204

Hiromi Tomiyama - Tokyo, JP
Takeyuki Nakagawa - Tokyo, JP
Naoki Kanayama - San Jose CA

Kabushiki Kaisha Shinkawa - Tokyo
Shinkawa U.S.A., Inc. - Santa Clara CA

G06K 900
G01N 2100
H01L 2348

382145

A method and apparatus for inspecting bends in wires bonded between, for instance, pads of semiconductor chips and leads of lead frames using detection ranges established within imaging ranges in which images of bends are taken. Imaging range areas are established by dividing the distance between a first bonding point and a second bonding point of a target wire by the width of the detection range, and the wire bend is then detected in the respective imaging range areas.