Search

Ralph Spayd Phones & Addresses

  • 102 Poplar Ln, Elizabethtown, PA 17022 (717) 367-9936
  • 201 Willow St, Elizabethtown, PA 17022
  • 221 E Willow St, Elizabethtown, PA 17022
  • 425 Sunrise Blvd, Elizabethtown, PA 17022
  • Salem, OR
  • Ocean City, NJ
  • Elizabeth, PA
  • Corvallis, OR
  • Bend, OR
  • York, PA

Work

Company: Franklin & marshall college Aug 2011 Position: Public opinion research

Education

School / High School: Pennsylvania State University- Harrisburg, PA 2006 Specialities: ME in Engineering

Skills

Public Opinion Research • Project Management • Analysis • Continuous Improvement • Microsoft Office • Cross Functional Team Leadership • Product Development • Six Sigma • Management • Product Management • Program Management

Industries

Public Policy

Professional Records

License Records

Ralph Edward Spayd

Address:
Elizabethtown, PA 17022
License #:
ET012266 - Expired
Category:
Engineers
Type:
Engineer in Training

Ralph Edward Spayd

Address:
Elizabethtown, PA 17022
License #:
PE082352 - Active
Category:
Engineers
Type:
Professional Engineer

Resumes

Resumes

Ralph Spayd Photo 1

Public Opinion Research

View page
Location:
102 Poplar Ln, Elizabethtown, PA 17022
Industry:
Public Policy
Work:
Franklin & Marshall College
Public Opinion Research
Skills:
Public Opinion Research
Project Management
Analysis
Continuous Improvement
Microsoft Office
Cross Functional Team Leadership
Product Development
Six Sigma
Management
Product Management
Program Management
Ralph Spayd Photo 2

Ralph Edward Spayd Iii Elizabethtown, PA

View page
Education:
Pennsylvania State University
Harrisburg, PA
2006 to 2008
ME in Engineering

Publications

Us Patents

Heat Sink Interface Insert

View page
US Patent:
20060171123, Aug 3, 2006
Filed:
Feb 1, 2005
Appl. No.:
11/049545
Inventors:
Craig Hornung - Harrisburg PA, US
John Larkin - Camp Hill PA, US
Ralph Spayd - Elizabethtown PA, US
International Classification:
H05K 7/20
US Classification:
361704000
Abstract:
A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.

Thermal Managed Interconnect System For A Circuit Board

View page
US Patent:
20060044763, Mar 2, 2006
Filed:
Aug 24, 2004
Appl. No.:
10/925091
Inventors:
Craig Hornung - Harrisburg PA, US
Ralph Spayd - Elizabethtown PA, US
Stephen Prete - Rehoboth MA, US
Chong Wang - Mansfield MA, US
International Classification:
H05K 7/20
US Classification:
361707000
Abstract:
A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.
Ralph E Spayd from Elizabethtown, PA, age ~51 Get Report