Robert N Starkston

6617683, Sep 9, 2003

Sep 28, 2001

09/964709

Vassoudevane Lebonheur - Tempe AZ
Robert Starkston - Phoenix AZ

Intel Corporation - Santan Clara CA

H01L 2334

257707, 257713, 257720, 257783, 438118, 438122

A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing unit and a heat spreader in the package. A modulus of elasticity of the thermal interface material in the kPa range is preferably provided by a cured, filled polymer gel which is lightly crosslinked. The gel thermal interface material enables the package to have a post end-of-line and post reliability testing thermal resistance across the thermal interface material between the flip chip and the heat spreader of 0. 45 cm  C. /Watt. Mitigation of thin film cracking in die and prevention of interfacial delamination upon temperature cycling are also attained.

7015592, Mar 21, 2006

Mar 19, 2004

10/804801

Robert Starkston - Phoenix AZ, US
Jason Zhang - Gilbert AZ, US

Intel Corporation - Santa Clara CA

H01L 23/29
H01L 21/44
H01L 21/48
H01L 21/50

257787, 257797, 438127

A marking is formed on an underfill between a die and a substrate.

7223638, May 29, 2007

May 13, 2004

10/846722

Robert Starkston - Phoenix AZ, US

Intel Corporation - Santa Clara CA

H01L 21/00

438122, 438118

A thermally conductive member is placed adjacent a microelectronic die with a thermal interface material between the microelectronic die and a wetting layer formed on a surface of the thermally conductive member. The thermal interface material is heated to cause reflow thereof. The first portion of the thermal interface material is directed by the wetting layer into a first cavity formed in the thermally conductive member. The thermal interface material is then allowed to cool and solidify.

7332423, Feb 19, 2008

Jun 29, 2005

11/170188

Robert Starkston - Phoenix AZ, US
Sridhar Narasimhan - Chandler AZ, US
Chia-Pin Chiu - Tempe AZ, US
Suzana Prstic - Chandler AZ, US
Patrick N Stover - Gilbert AZ, US
Hong Xie - Phoenix AZ, US

Intel Corporation - Santa Clara CA

H01L 21/44

438612, 438613, 438615

One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.

7772090, Aug 10, 2010

Sep 30, 2003

10/674960

Robert Starkston - Phoenix AZ, US
Andrew Proctor - Chandler AZ, US
Steve Terry - Glendale AZ, US

Intel Corporation - Santa Clara CA

H01L 21/301

438462, 438463

A method for singulating dies from a wafer includes laser scribing a continuous line on each side of the die, and laser ablating an area adjacent the laser scribed continuous line on each side of the die. The laser ablations in the area adjacent the laser scribed continuous line on each side of the die being spaced from one another. The method also includes sawing the laser abated area adjacent the continuous line. A method for singulating dies from a wafer includes laser scribing a first continuous line, laser scribing a second continuous line spaced apart from the first continuous line, and laser scribing a third continuous line. The third continuous line positioned between the first continuous line and the second continuous line. The third continuous line overlaps the second continuous line and the third continuous line.

8364304, Jan 29, 2013

Jul 14, 2010

12/836448

Robert Starkston - Phoenix AZ, US
Andrew Proctor - Chandler AZ, US
Steve Terry - Glendale AZ, US

Intel Corporation - Santa Clara CA

H01L 21/301
H01L 21/304

700166, 264400, 2191216, 483463

A method for singulating dies from a wafer includes laser scribing a continuous line on each side of the die, and laser ablating an area adjacent the laser scribed continuous line on each side of the die. The laser ablations in the area adjacent the laser scribed continuous line on each side of the die being spaced from one another. The method also includes sawing the laser abated area adjacent the continuous line. A method for singulating dies from a wafer includes laser scribing a first continuous line, laser scribing a second continuous line spaced apart from the first continuous line, and laser scribing a third continuous line. The third continuous line positioned between the first continuous line and the second continuous line. The third continuous line overlaps the second continuous line and the third continuous line.

46473971, Mar 3, 1987

Apr 29, 1985

6/728439

Robert Starkston - San Rafael CA
Mark C. Luce - Vallejo CA
Robert V. Homsy - Orinda CA

Chevron Research Company - San Francisco CA

C09K 300

252189

Process and composition for removing H. sub. 2 S and like sulfides from gas streams by contact with a substituted aromatic nitrile having an electron-attracting substituent on the aromatic ring at least as strong as halogen (e. g. , isophthalonitrile) and an organic tertiary amine in an inert organic solvent such as N-methyl-2-pyrrolidone.

6239973, May 29, 2001

Mar 27, 2000

9/535424

Scot W. Taylor - Apache Junction AZ
Robert Starkston - Chandler AZ
Charles Gealer - Phoenix AZ
Michael L. Rutigliano - Chandler AZ
Raymond A. Krick - Gilbert AZ
John A. Rabenius - Tempe AZ
Edmond L. Hart - Chandler AZ
Ravi V. Mahajan - Tempe AZ
Farukh Fares - Phoenix AZ

Intel Corporation - Santa Clara CA

H05H 720

361704

An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.