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Sassan Khatib Shahidi

from San Jose, CA
Age ~63
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Also known as:
Sassan K Shahidi, Sassan Khatib, Sassan Khatibshahidi, Shahidi Sassan Khatib, Shahnaz K Shahidi, Shahnaz S Shahidi, Sassan B, Soheil Shahidi
Phone and address:
1314 Rimrock Dr, San Jose, CA 95120
(408) 234-5626
Related to:
Leah D GranvilleSoheil K Shahidi, 92Priscilla CortezBaloy B CortezKhosrow K Shahidi, 92Khatib Shahidi KhorowLarry B Cortez, 64Arian Shahidi, 33Khorow KhatibshahidiNasrin Living Naaseh, 72Freydoon Naasehshahri, 98Soheil Kh ShadidiArian K Shahidi, 32Shirin S Naaseh, 63Sohel ShahidiRoberta L Khatib, 68Rosemary C Shahidi, 67Mitra Shahri, 59Roberta L KhatibArmand Khatibshahidi, 30
Connected to:
Asl M Shahidi, 63Awide Shahidi, 34Badiollah F Shahidian, 96Jamil Shahidi, 71Mohssen A Shahidi, 78Nikta N Shahidi, 82Said A Shahidi, 59Saloumeh A Shahidi, 48Susana C Shahidi, 62Al K Shahiduzzaman, 51

Sassan Shahidi Phones & Addresses

  • 1314 Rimrock Dr, San Jose, CA 95120 (408) 234-5626
  • 1115 Virgil Pl, San Jose, CA 95120 (408) 323-0525
  • 6925 Silvergate Ct, San Jose, CA 95120
  • San Francisco, CA
  • Sheridan, CA
  • Milpitas, CA
  • Red Bluff, CA
  • Los Gatos, CA
  • 1314 Rimrock Dr, San Jose, CA 95120

Resumes

Resumes

Sassan Shahidi Photo 1

Hardware Engineering

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Location:
San Jose, CA
Industry:
Information Technology And Services
Work:
Ibm
Hardware Engineering
Sassan Shahidi Photo 2

Data Storage Engineering At Ibm

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Location:
15 Polk Ct, North Potomac, MD 20878
Industry:
Information Technology And Services
Work:
Wonder Tires
President
Cardiac Mariners Inc Jun 1997 - Jul 1998
Manufacturing Manager
Siemens Healthcare 1987 - 1997
Transducer Engineering Manager
Ibm 1987 - 1997
Data Storage Engineering at Ibm
Mullen Equipment Co Jun 1984 - Jul 1987
Senior Mechanical Design Engineer
Education:
California State University - Sacramento 1980 - 1983
Master of Science, Masters, Mechanical Engineering California State University - Sacramento 1979 - 1981
Bachelors, Bachelor of Science, Mechanical Engineering Ca. State University
Skills:
Manufacturing
Integration
Medical Devices
Testing
Product Development
Management
Product Management
Fda
Process Improvement
Cross Functional Team Leadership
Engineering
Research and Development
Start Ups
U.s. Food and Drug Administration

Publications

Us Patents

Method And Apparatus For Embedding A Chip In A Substrate To Form A Composite Air Bearing Surface

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US Patent:
7082013, Jul 25, 2006
Filed:
May 6, 2003
Appl. No.:
10/431247
Inventors:
Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 17/32
US Classification:
3602347
Abstract:
A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.

Method For Producing And Inspecting Tape Head Air-Skiving Edges

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US Patent:
7167339, Jan 23, 2007
Filed:
Dec 3, 2003
Appl. No.:
10/727788
Inventors:
Robert Glenn Biskeborn - Hollister CA, US
Luis Hector Palacios Borja - Mountain View CA, US
Calvin Shyhjong Lo - Saratoga CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5/187
US Classification:
360122, 2960316
Abstract:
A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

Tape Head Read/Write Module

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US Patent:
7274536, Sep 25, 2007
Filed:
Jun 7, 2006
Appl. No.:
11/449443
Inventors:
Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5/127
US Classification:
3602347
Abstract:
A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Tape Head Read/Write Module

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US Patent:
7492552, Feb 17, 2009
Filed:
Aug 4, 2007
Appl. No.:
11/833973
Inventors:
Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5/127
US Classification:
3602344
Abstract:
A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Cable Having Translucent, Semi-Transparent Or Transparent Esd Dissipative Layer And/Or Metallic Layer

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US Patent:
7525047, Apr 28, 2009
Filed:
Jul 23, 2007
Appl. No.:
11/781850
Inventors:
Icko E. T. Iben - Santa Clara CA, US
Sassan K. Shahidi - San Jose CA, US
George G. Zamora - Vail AZ, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01B 7/08
US Classification:
174117FF, 174254
Abstract:
A cable in one embodiment includes a plurality of leads; and an electrostatic discharge (ESD) dissipative layer operatively coupled to the leads, the ESD dissipative layer being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; an ESD dissipative layer operatively coupled to the leads, the ESD dissipative layer; and a metallic layer operatively coupled to the leads, the metallic and ESD dissipative layers being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; a metallic layer operatively coupled to the leads, the metallic layer being characterized as being at least one of translucent, semi-transparent or transparent, wherein the metallic layer has a volume resistivity of greater than 1×10ohmcm as defined by ANSI/EIA-541-1988; and an insulating layer positioned between the metallic layer and the leads.

Flexible Cable Comprising Liquid Crystal Polymer

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US Patent:
8213120, Jul 3, 2012
Filed:
Sep 10, 2007
Appl. No.:
11/852667
Inventors:
Sassan K. Shahidi - San Jose CA, US
Larry LeeRoy Tretter - Tucscon AZ, US
George G. Zamora - Vail AZ, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 23/02
G11B 33/04
US Classification:
360137, 360128
Abstract:
A tape drive system according to one general embodiment includes a magnetic head; a drive mechanism for passing a magnetic recording tape over the head; a cable coupled to the magnetic head, the cable comprising a first layer of liquid crystal polymer, and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer; and a controller coupled to the cable, and communicating with the head using the cable. A cable according to another general embodiment includes a first layer of liquid crystal polymer; and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer.

Cable Having Esd Dissipative Layer Electrically Coupled To Leads Thereof

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US Patent:
8405950, Mar 26, 2013
Filed:
May 21, 2008
Appl. No.:
12/125007
Inventors:
Icko E. Tim Iben - Santa Clara CA, US
Wayne Alan McKinley - Tucson AZ, US
Sassan K. Shahidi - San Jose CA, US
George G. Zamora - Vail AZ, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01H 47/00
US Classification:
361220
Abstract:
A cable having an electrostatic discharge (ESD) dissipative layer in one embodiment includes a plurality of leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A cable having an electrostatic discharge (ESD) dissipative layer in another embodiment comprises at least 16 leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A method for fabricating a cable in one embodiment comprises coupling an electrostatic discharge (ESD) dissipative layer to a plurality of leads using a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer.

Electrostatic Discharge (Esd) Protection For Electronic Devices Using Wire-Bonding

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US Patent:
8514534, Aug 20, 2013
Filed:
Jul 20, 2010
Appl. No.:
12/839528
Inventors:
Dylan J. Boday - Tucson AZ, US
Peter J. Golcher - Los Gatos CA, US
Icko E. T. Iben - Santa Clara CA, US
Sassan K. Shahidi - San Jose CA, US
Joyce L. S. Tang - Dublin CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H02H 9/00
H02H 3/20
H02H 9/04
H02H 3/22
US Classification:
361 56, 361 911, 361111
Abstract:
A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.
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Sassan Khatib Shahidi from San Jose, CA, age ~63 Get Report