Inventors:
Ming Jang Hwang - Dallas TX
Keizo Hosoda - Plano TX
Shintaro Aoyama - Dallas TX
Tadashi Terasaki - Yatbuo-Machi, JP
Tsuyoshi Tamaru - Ome, JP
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2131
US Classification:
438758, 118715, 118730, 427 38, 427255
Abstract:
A method of reducing by-product deposition inside wafer processing equipment includes providing a chamber having a peripheral inner wall and placing a semiconductor wafer within the chamber. The method also includes placing a ring within the chamber proximate the peripheral inner wall and introducing a plurality of reactant gases into the chamber and reacting the gases. The method also includes introducing a heated gas into the chamber through the ring proximate the peripheral inner wall to increase the temperature of the peripheral inner wall.