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Srinivas B Rao

from Blackwood, NJ
Age ~57
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Also known as:
Srinivas Rao Bolugoddu, Srinivas R Bolugoddu, Srinaves Bolugoddu, Srinivasrao R Bolugoddu, Frinivas Bolugoddu, Srinivas U, U Rao
Related to:
Lisa Wilson Vohra, 70Sridevi Bolugoddu, 48Srinivas Bolugoddu, 57
Connected to:
Abishek R Rao, 32Ajith Rao, 42Bapu Rao, 105Begur N Rao, 53Carolyn M Rao, 73Cheandra G Rao, 53Chintalapudi K Rao, 85Coralia E Rao, 82Dalipardhy Rao, 75Danette Rao, 82

Srinivas Rao Phones & Addresses

  • Blackwood, NJ
  • Flushing, NY
  • Camden, NJ

Work

Company: Tangella associates Address: 157 Main St, Hempstead, NY 11550 Phones: (516) 564-4656 Position: Ceo Industries: Radio, Television, and Consumer Electronics Stores

Professional Records

Medicine Doctors

Srinivas Rao Photo 1

Srinivas P. Rao

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Specialties:
Radiology, Vascular & Interventional Rad
Work:
Gulf Coast MRI & Diagnostic Center
3692 E Sam Houston Pkwy S, Pasadena, TX 77505
(281) 991-1674 (phone), (281) 991-3800 (fax)

Texas Vein & Wellness Institute
11221 Katy Fwy STE 115, Houston, TX 77079
(281) 888-1464 (phone), (713) 640-5938 (fax)
Education:
Medical School
Baylor College of Medicine
Graduated: 1989
Languages:
English
Description:
Dr. Rao graduated from the Baylor College of Medicine in 1989. He works in Pasadena, TX and 1 other location and specializes in Radiology and Vascular & Interventional Rad. Dr. Rao is affiliated with West Houston Medical Center.

Business Records

Name / Title
Company / Classification
Phones & Addresses
Srinivas Rao
CEO
Tangella Associates
Radio, Television, and Consumer Electronics S...
157 Main St, Hempstead, NY 11550
Srinivas Rao
CEO
Tangella Associates
Radio, Television, and Consumer Electronics S...
157 Main St, Hempstead, NY 11550
Srinivas Rao
President
AUJAS NETWORKS PRIVATE LIMITED
Srinivas Rao
CONSIOUS TECHNOLOGY LLC

Publications

Us Patents

Method For Fabricating Via Connectors Through Semiconductor Wafers

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US Patent:
44459785, May 1, 1984
Filed:
Mar 9, 1983
Appl. No.:
6/473551
Inventors:
James C. Whartenby - Trenton NJ
Richard Brown - Berkeley Heights NJ
Srinivas T. Rao - Kendall Park NJ
Raymond J. Menna - Jenkintown PA
Assignee:
RCA Corporation - New York NY
International Classification:
C25D 502
C25D 704
US Classification:
204 15
Abstract:
A method is provided for fabricating a via connector from a first surface of a semiconductor wafer to an opposite second surface of the wafer. The first step consists of forming an adherent metal layer on the first surface on the semiconductor wafer. If the first surface of the semiconductor wafer has electronic components formed thereon, the metal layer is applied over the electronic components and preferably a protective layer of material is formed over the metal layer. Via holes are then laser drilled at predetermined locations through the metal layer and then through the semiconductor wafer. Thereafter a photoresist layer is applied over the first surface and exposed and developed to provide passage holes in the photoresist which are in alignment with the laser drilled apertures. The metal layer is then connected in the cathode position of the electroforming apparatus and via connectors are thereafter electroformed in the via holes.

Isbn (Books And Publications)

Sustainability of Agricultural Systems in Transition: Proceesings of an International Symposium, "Sustainability in Agricultural Systems , Baltimore, Md. 20-22 Oct. 1998

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Author

Srinivas C. Rao

ISBN #

0891181490

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Srinivas B Rao from Blackwood, NJ, age ~57 Get Report