Thitima Suwannasiri

Microeletronic Research Laboratory, IBM
Yorktown Heights, NY
Oct 2011 to Sep 2012
Process Engineer
NASA-GSFC/University of Maryland
Greenbelt, MD
Mar 2010 to Jun 2011
Research Associate
Solid State Division, Oak Ridge National Laboratory
Oak Ridge, TN
1997 to 1999
Postdoctoral Associate
Ceramics Science and Engineering Department, Rutgers University
Piscataway, NJ
1990 to 1997
Graduate Assistant
Department of Materials Science, Chulalongkorn University, Bangkok, Thailand

1989 to 1990
Research Assistant

University of British Columbia
May 2001
Master of Software Systems in Canada
Rutgers University
Piscataway, NJ
Jan 1990 to Jan 1997
PhD. in Ceramics Science and Engineering
Chulalongkorn University
Apr 1988
B.S. in Materials Science

Micro/Nano-Electronics Wafer Processing: Cleanroom protocols, wafer cleaning, photolithography, wet chemical etching, DRIE, RIE, vapor-phase etching, thermal and e-beam evaporation, sputtering, ALD, ion milling, thermal oxide growth, LPCVD, RTP, RTCVD, wafer bonding, profilometry, reflectometry, ellipsometry, stress measurement. Ceramics Processing: Colliodal Chemistry, sol-gel powder synthesis, powder dispersion and formulation, slip and tape casting, attrition milling, ball milling, uniaxial pressing, CIP, HIP, and atmospheric sintering. Materials Characterization: SEM, TEM, BET, XRD, particle size analysis, rheology and electrophoretic mobility measurements, mechanical testing, electrochemical analyses, electrical property analyses. Statistical Analyses and Design of Experiments Computer: MS Office, AutoCAD, C++, VB, Java. Languages: Fluent in English and Thai.