Tom S Glowinke

from Naperville, IL

Age ~78

Get Report

Tom Glowinke Phones & Addresses

1140 Mary Ln, Naperville, IL 60540 (630) 357-6070
Glenview, IL
Chicago, IL
Evanston, IL
Cherry Hill, NJ
1140 Mary Ln, Naperville, IL 60540 (630) 677-3128

Work

Company: Bell systems Position: Retired

Education

Degree: Doctorates, Bachelors, Doctor of Philosophy, Bachelor of Science School / High School: Northwestern University

Skills

Product Development • Project Management • Lean Manufacturing • Cross Functional Team Leadership • Six Sigma • Java • Manufacturing • Engineering • Negotiation

Languages

English

Interests

Football • Collecting Antiques • Exercise • Home Improvement • Shooting • Reading • Gourmet Cooking • Sports • Watching Basketball • The Arts • Golf • Home Decoration • Watching Sports • Cooking • Electronics • Outdoors • Sewing • Crafts • Fitness • Music • Dogs • Movies • Collecting • Diet • Woodwork • Career • Investing • Basketball • Watching Football

Industries

Electrical/Electronic Manufacturing

Resumes

Tom Glowinke

View page

Location:

1140 Mary Ln, Naperville, IL 60540

Industry:

Electrical/Electronic Manufacturing

Work:

Bell Systems
Retired

Education:

Northwestern University
Doctorates, Bachelors, Doctor of Philosophy, Bachelor of Science

Skills:

Product Development
Project Management
Lean Manufacturing
Cross Functional Team Leadership
Six Sigma
Java
Manufacturing
Engineering
Negotiation

Interests:

Football
Collecting Antiques
Exercise
Home Improvement
Shooting
Reading
Gourmet Cooking
Sports
Watching Basketball
The Arts
Golf
Home Decoration
Watching Sports
Cooking
Electronics
Outdoors
Sewing
Crafts
Fitness
Music
Dogs
Movies
Collecting
Diet
Woodwork
Career
Investing
Basketball
Watching Football

Languages:

English

Publications

Us Patents

Attaching Heat Sinks To Integrated Circuit Packages

View page

US Patent:

7482688, Jan 27, 2009

Filed:

Apr 26, 2006

Appl. No.:

11/411627

Inventors:

Tom S. Glowinke - Naperville IL, US

Assignee:

Alcatel-Lucent USA Inc. - Murray Hill NJ

International Classification:

H01L 23/34
F28F 7/00
H05K 7/20

US Classification:

257713, 361704, 361709, 165 802, 174 163

Abstract:

This invention relates to arrangements for attaching a heat sink to an integrated circuit package. The heat sink comprises magnetic material, magnetized in one polarity, and the circuit package comprises magnetic material either unmagnetized or magnetized in the opposite polarity. When the heat sink and circuit package are placed in contact with one another, they are attracted magnetically. This forms a bond for attaching the heat sink to the integrated circuit package. Advantageously, this arrangement for attracting a heat sink avoids distorting or otherwise damaging the circuit package and speeds assembly time.

Control profile

Tom S Glowinke from Naperville, IL, age ~78 Get Report