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William Verzosa Lutap

from Tustin, CA
Age ~66
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Also known as:
William V Lutap, William B Lutap, William V Lute, William V Luto, William P
Phone and address:
14602 Devonshire Ave, Tustin, CA 92780
(714) 838-0824
Related to:
Ytap L Janet, 38John QuizonLeove Quizon, 42Vergilio Quizon
Connected to:
Deanna R Lutat, 55Parmanand Lutawan, 57Margaret A Lutcavage, 81Delanor F Lutch, 84Morton Lutch, 99Christopher J Lutchen, 35George D Lutchendorf, 56James Lutchka, 87John J Lutchka, 59Adash Lutchman, 42

William Lutap Phones & Addresses

  • 14602 Devonshire Ave, Tustin, CA 92780 (714) 838-0824 (714) 838-7970 (714) 838-9934
  • 1722 Mitchell Ave, Tustin, CA 92780
  • North Las Vegas, NV
  • San Diego, CA
  • Carson, CA
  • Las Vegas, NV

Work

Company: Imi usa 2005 Position: Engineering manager

Education

Degree: Bachelor of Science In Mechanical Engineering, Bachelors School / High School: University of Santo Tomas

Languages

English • Tagalog

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

William Lutap Photo 1

Engineering Manager

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Location:
Tustin, CA
Industry:
Electrical/Electronic Manufacturing
Work:
Imi Usa
Engineering Manager
Education:
University of Santo Tomas
Bachelor of Science In Mechanical Engineering, Bachelors
Languages:
English
Tagalog

Publications

Us Patents

Vacuum Pallet Reflow

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US Patent:
20120273559, Nov 1, 2012
Filed:
Apr 27, 2012
Appl. No.:
13/457670
Inventors:
Timothy P. Patterson - Mission Viejo CA, US
William Lutap - Tustin CA, US
Roger Nguyen - Irvine CA, US
International Classification:
B23K 31/02
B23K 3/08
US Classification:
228221, 228 33, 228 8, 228218
Abstract:
A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

Vacuum Pallet Reflow

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US Patent:
20150342061, Nov 26, 2015
Filed:
Aug 6, 2015
Appl. No.:
14/820025
Inventors:
- Tustin CA, US
William Lutap - Tustin CA, US
Roger Nguyen - Irvine CA, US
International Classification:
H05K 3/34
B23K 1/20
B23K 3/08
B23K 1/00
Abstract:
A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
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William Verzosa Lutap from Tustin, CA, age ~66 Get Report